National Repository of Grey Literature 108 records found  beginprevious89 - 98next  jump to record: Search took 0.01 seconds. 
Heat measurement of electric machine
Trnka, Zbyněk ; Vítek, Ondřej (referee) ; Janda, Marcel (advisor)
The aim of this bachelor´s thesis was to familiarize with various methods of measurement of the temperature of electrical machines with cooling. The introduction of this work is dedicated to basic terms and definitions from spheres of advection, circulation, losses and heat removal from electric machine. The attention is especially devoted to contact measurement by means of thermocouples and next the measurement of temperature without contact. Finally, the work goes into analysis of losses, heat removal and measurement of the temperature of asynchronous machine.
Thermocouple simulator
Nermut, Martin ; Michalec, Jaroslav (referee) ; Klusáček, Stanislav (advisor)
NERMUT, M. Thermocouple simulator. Brno: Brno University of Technology, Faculty of Eletrical Engineering and Communication. 2009. 62 s. Supervisor Ing. Stanislav Klusáček. Consultant Ing. Miroslav Krupa, - IDC Brno, Honeywell s.r.o. The aim of the thesis is design and realization of handheld thermocouple simulator, suitable both for laboratory and plant use. Manual or remote control via RS232 are possible. Special attention is focused on universality, easy and safety use (galvanic isolation), properly cold junction compensation, easy calibration of non-linearity. Sponsor: IDC Honeywell, Brno, Czech Republic Basic literature: - OMEGA Temperature Handbook) - Datasheets of OMEGA instruments (www.omega.com) - Datasheets of other vendor instruments (www) - Isotech Traceable Book – Temperature Calibrabration (www.isotech.co.uk) - BELZA J., Buld-in Li-ion accu charger (www.belza.cz) Appendixs: - User manual - Schematic - Calibration data - CD (source code)
QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
Thermoelectric cell (TC)
Přidal, Oldřich ; Beneš, Petr (referee) ; Bejček, Ludvík (advisor)
This thesis is parted to several sections. Firstly is dealt about problems of measuring temperature with thermocouple sensors. Secondly are described basic principles of thermoelectric modules and resistance temperature detectors. Thirdly is written about design and realization of workplace for BMFV, MSNV and MMNV classes. Finally is shown results of experimental measurement.
Analysis of the distribution of the temperature profile in the furnace brazing using CAE systems
Stručovský, Aleš ; Vyroubal, Petr (referee) ; Maxa, Jiří (advisor)
The aim of this project is using the CAE system to analyze the distribution of the temperature profile brazing furnace DIMA 0180. To create the model is used SolidWorks Premium 2012. The simulation is performed using the Flow Simulation. This work builds on the knowledge diploma thesis by Martin Procházka titled The effect of different heat capacities and components on the longitudinal temperature profile for reflow soldering. We start from the knowledge of heat transfer, especially of heat conduction and radiation, which appear in the furnace.
Temperature Profile in Reflow Soldering and Influence of Different PCBś and ComponentsThermal Capacities
Procházka, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.
The equipment for control very low temperatures during the detection defects of solar cells
Stojan, Radek ; Bača, Petr (referee) ; Vaněk, Jiří (advisor)
This work deals with measuring of very low temperatures during the detection defects of solar cells by photoluminescence method. Liquid nitrogen is used to cooling solar cells. Properties of liquid nitrogen and safety of handling are described in this work. Themperature in cryo area is measured by the thermocouple senzors. A main part of this work was to concept and creation of equipment for themperature controling in cryo technique. This equipment signalling danger scorch in low temperatures. The device was created to complement work place for the detection defects of solar cells by photoluminescence method.
Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
Study of thermal properties of selected coloids
Křivánková, Kateřina ; Krouská, Jitka (referee) ; Zmeškal, Oldřich (advisor)
The bachelor thesis is focused on the study of the thermal properties of colloidal systems, especially the properties of emulsions (water, oil), which can be used in the cosmetic industry as an essential component of various lotions and creams and in the food industry. In the introduction the first defined thermo-physical processes (conduction, convection and radiation) and temperature measurement (stationary, transient). Furthermore defined physical parameters (heat and thermal conductivity, heat capacity), that are determined using transient methods. The measured data were collected and analyzed by using the EMA (Electrical Measurement Analyser) and the HarFA (Harmonic and Fractal Image Analyser). The results will be used to determine the optimum conditions for the production of cosmetics and dietary supplements.
Methods for measuring exhaust gas temperature before turbocharger
Vajdák, Martin ; Jaroš, Michal (referee) ; Štětina, Josef (advisor)
This bachelor´s thesis deals with the measurement of exhaust gas temperature before turbocharger in Honeywell laboratories. In the introduction of thesis the general methods of turbocharging are described. The following sections deals with the temperature measurement generally, issues of insertion thermocouples in measuring section and their connection. Another part is devoted inaccuracies, which may occur during the measurement, and also ways of their elimination. The main part of the thesis consists of sixth chapter in which major, but also smaller influences, are analyzed in details and cleared up with examples, because this influences are the source of inaccuracies during the temperature measurements. These influences are especially different wall temperature of measuring section and the flowing exhaust gases and influence of thermocouple emissivity change over the time.

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