Original title: Měření teplotních profilů SMD pouzder
Translated title: Temperature Profiles Measurement of SMD Packages
Authors: Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2010
Language: slo
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [slo] [eng]

Keywords: 1206.; finite difference method; lumped capacitance method; package; PCB; PLCC; reflow; SMD; temperature management; temperature profile; Thermocouple

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/6233

Permalink: http://www.nusl.cz/ntk/nusl-218369


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2016-06-03, last modified 2022-09-04


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