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Design of device for determination of air mean temperature in the channel with various crossection
Tichý, Vojtěch ; Musil, Filip (referee) ; Vlach, Radek (advisor)
Diploma thesis was dealing with design of the device for measuring the mean temperature in a channel of any cross-section. First, the theory of heat, heat transfer and fluid flow was summarized. Theory was focused specially on the uneven temperature distribution in the flowing medium. Furthermore, a general overview of commercially used temperature sensors and developed sensors with applicability to the investigated problematics was elaborated. Then, a device for sensing mean temperature in a flow channel for several different diameters has been fully designed and developed. The device included the temperature sensor itself, the necessary measurement electronics and its programming, and a simple measurement data application.
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Heating of apartment buildings
Diatel, Jakub ; Horká, Lucie (referee) ; Počinková, Marcela (advisor)
The topic of this diploma thesis is heating of apartment buildings, where an attention was focused on thermal comfort in heated rooms. The first theoretical part brings results of CFD simulations which compare radiators with floor heating. The second part consits of practical application o the given building. There are two options in this project - heating by radiators or floor heating. The third part describes two experiments - measurement of indoor environment in two rooms and measurement of gas consumption in apartment buildings with different heating concepts. In the last part the mean radiant temperature is simulated. There are compared different kind of heating, which have impact to distribution of mean radiant temperature in the room. The personal software was created for deeper understanding of mean radiant temperature.
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Analysis of Defects on PCB Using Modern Optical Method
Vala, Martin ; Řezníček, Michal (referee) ; Řihák, Pavel (advisor)
This diploma thesis is focused on detecting of defects on BGA (Ball Grid Array) components using of X-ray. Defects are formed during reflow BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection or micro sections. There is disclosed a device NORDSON DAGE XD7600NT its operation and setup. The device enables advanced methods of scanning called X-plane. For creating 3D models used reconstructive software called CERA, which uses raw data from the method of X-Plane.
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Visualization of input parameters for radiation transfer in plasma
Kubovič, Tomáš ; Aubrecht, Vladimír (referee) ; Kloc, Petr (advisor)
This bachelors thesis focuses on simplification of the input parameters for electrical arc radiation transfer calculations. In the first part, we learn basics of transfer for thermal radiation and calculation of the absorption and emission coefficients. Next part is devoted to the design of absorption model and describes various parts of the model. It is followed by a graphical design of the interface which also displays various graphs. The next chapter explains the operating principle of the software application. The last chapter shows an example of the plot for computing domain.
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Flux Residues after Reflow Soldering
Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
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Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
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Analysis of the distribution of the temperature profile in the furnace brazing using CAE systems
Stručovský, Aleš ; Vyroubal, Petr (referee) ; Maxa, Jiří (advisor)
The aim of this project is using the CAE system to analyze the distribution of the temperature profile brazing furnace DIMA 0180. To create the model is used SolidWorks Premium 2012. The simulation is performed using the Flow Simulation. This work builds on the knowledge diploma thesis by Martin Procházka titled The effect of different heat capacities and components on the longitudinal temperature profile for reflow soldering. We start from the knowledge of heat transfer, especially of heat conduction and radiation, which appear in the furnace.
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Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
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Temperature Profile in Reflow Soldering and Influence of Different PCBś and ComponentsThermal Capacities
Procházka, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.
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Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
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