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Surface and Mechanical Properties of Thin Films
Pálesch, Erik ; Klapetek, Petr (referee) ; Skuhurov,, Andrey (referee) ; Čech, Vladimír (advisor)
The doctoral thesis deals with the study of morphology and mechanical properties of thin plasma polymer films based on tetravinylsilane monomer and its mixtures with oxygen and argon. Thin films were prepared by plasma-enhanced chemical vapour deposition on silicon and glass substrates. Atomic force microscopy was used for characterization of thin film surface and for depiction of composite interphase with functional interlayer. Mechanical properties of thin films, namely Young’s modulus and hardness, were studied by cyclic nanoindentation technique. Nanoindentation device was also used to carry out scratch test, which was helpful to describe adhesion of films to substrate. In this thesis the influence of deposition conditions on surface and mechanical properties of thin films prepared in continual and pulse wave on planar substrates is discussed. Also, the suitability of few atomic force microscopy techniques for depiction of composite interphase was reviewed.
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Determination of elastic modulus of thin layer - numerical study of microcompressive test and the bulge test
Petráčková, Klára ; Pokorný, Pavel (referee) ; Náhlík, Luboš (advisor)
Determination of mechanical properties of very thin films is rather difficult task as all of currently using testing techniques have some weakness. This master’s thesis deals with microcompressive test and bulge test. Finite element simulations of the two methods were carried out in order to better understanding of experimental record. Microcompression combines the sample preparation with the use of focused ion beam (FIB) with a compression test carried out using nanoindenter. Cylindrical specimens (pillars) were prepared from Al film deposited on Si substrate using FIB. Experimentally measured data on pillars needs correction to obtain undistorted material properties of Al thin film. A necessary correction using FE modeling is suggested in the thesis. Second part of the work is focused on modeling of bulge test. Pressure is applied on freestanding SiNx film while deflection of the film is measured. Stress state in the film is biaxial making determination of mechanical properties of the film more complicated. The goal is to present how to model the whole problem. In addition, preparation of the specimens was simulated to estimate residual stress in the film. The paper contributes to a better characterization of very thin surface layers and determination of their mechanical properties.
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Development of Nanofabrication Methodology for Study of Mechanical Properties of Thin Films using Focused Ion Beams
Kuběna, Ivo ; Švejcar, Jiří (referee) ; Kruml, Tomáš (advisor)
The main goal of this work is to find a methodology of the fabrication of microcompressive specimens (pillars) from thin metallic film prepared by means of PVD. The studied film was prepared by the ON Semiconductor company, Roznov pod Radhostem. Its chemical composition was Al-1.5 wt.% Cu; such films are used for electric connections on integrated circuits. At first, a thin intermediate layer of W-10 wt.% Ti was deposited on the Si single crystalline substrate with the purpose of improving adhesion properties of the studied film. The geometry of the microcompressive specimen should be as close to the cylindrical shape as possible. The height of the cylinder is given by the film thickness, its diameter is approximately 1 m. Such specimens were prepared in Quanta 3D FEG Dual BeamTM facility using focused ion beams technology. Experiments were done at FEI Company in Brno. In total, 39 microcompressive specimens were prepared at various ion milling conditions. The required geometry was finally attained by the optimization of processing parameters, in particular the parallelism of lateral faces was improved, the bottom of the removed zone in the vicinity of the pillar was almost flat and the transition pillar – flat bottom was regular. The prepared pillars are suitable for the microcompression tests; the first of them have been already performed within the cooperation with the Institut of Physics, Academy of Sciences of the Czech Republic, Praha.
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Surface analysis of xGnP/PEI nanocomposite
Červenka, Jiří ; Klapetek, Petr (referee) ; Čech, Vladimír (advisor)
Tato Diplomová práce se zabývá povrchovou analýzou nanokompozitní folie polyetherimidu (PEI) vyztuženého exfoliovanými grafitickými nanodestičkami (xGnP). Analyzovány byly take vzorky nevyztužené PEI folie a samostatné nanodestičky. Vzorky nanokompozitu a PEI folie byly plazmaticky leptány s využitím argonového plazmatu po dobu 1, 3 a 10 hod. Skenovací elektronová mikroskopie (SEM) byla použita pro charakterizaci samostatných nanodestiček rozptýlených na křemíkovém substrátu, původních či leptaných vzorků PEI folie a nanokompozitu. Nanodestičky byly identifikovány při povrchu leptané nanokompozitní folie. Mikroskopie atomárních sil (AFM) byla použita pro zobrazení povrchové topografie separovaných nanodestiček a odkrytých destiček při povrchu leptaného kompozitu. Povrchová drsnost (střední kvadratická hodnota, vzdálenost nejnižšího a nejvyššího bodu) leptaného nanokompozitu narůstala s prodlužující se dobou leptání. Akustická mikroskopie atomárních sil (AFAM) byla použita pro charakterizaci elastické anizotropie leptaných kompozitních vzorků. Nanoindentační měření umožnila charakterizaci lokálních mechanických vlastností PEI a nanokompozitních folií.
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Adhesion of plasma polymer films deposited from tetravinylsilane monomer
Plichta, Tomáš ; Salyk, Ota (referee) ; Čech, Vladimír (advisor)
This bachelor thesis deals with the characterization of thin films of plasma polymers prepared from monomers of tetravinylsilane (TVS) and deposited on planar silicon substrates. Plasma enhanced chemical vapor deposition (PE CVD) was used as a method of thin films preparation. Three power series were prepared from pure TVS and two mixtures TVS with argon and oxygen. The main characterization methods were scratch tests and atomic force microscopy (AFM) is used to assess the adhesion degree of the layers and topography of scratches. To assess the characteristics and context the layer thickness was measured by spectroscopic ellipsometry (ELL) and elastic modulus using nanoindentation. The collected data were used to assess the reproducibility of the results with the regard to the purity of substrates and adhesion layers, depending on the deposition conditions and layers aging.
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Compressive testing of pillars: numerical study
Petráčková, Klára ; Zouhar, Michal (referee) ; Náhlík, Luboš (advisor)
Determination of mechanical properties of thin films, which are used e.g. in electronics, is not simple due to the required very sophisticated equipments. Also the interpretation of results is rather difficult. This bachelor’s thesis is focused on determination of important factors which affect the microcompressive testing results. For microcompressive testing, the pillars made from studied thin film attached by the bottom to a substrate are used. There can be another thin interlayer between studied film and the substrate. The pillar is made by focused ion beam (FIB). Pillar is loaded by a nanoindenter with flat tip while the deformation response is measured. The goal of the thesis is numerical simulation (using the Finite Element Method) of the microcompressive testing and determination of individual specific geometric factors of tested pillars on Young’s modulus of the thin film. Data from microcompressive testing of aluminium thin film attached to silicon substrate with tungsten interlayer were available for numerical simulation. We have estimated influence of specific pillar geometry on data using compressive testing and improved evaluation of Young’s modulus. We have presented a recommendation for more accurate evaluation of Young’s modulus determined from experimental data involving inaccuracy following the pillar shape. The results and methods presented in this thesis can be useful in future development of compressive testing technique for determination of mechanical properties of metal thin films.
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A Comparison of Different Measurement Method of Mechanical Properties of Al Thin Film
Truhlář, M. ; Buršíková, V. ; Sobota, Jaroslav ; Kruml, Tomáš
The paper compares two different methods for testing of metallic thin films: microcompression test and nanoindentation. Microcompression test is one possibility how to perform mechanical tests on a very small scale. This method requires preparation of a small cylindrical specimen (micropillar) of micrometric size by FIB and execution of a compression test using nanoindenter device equipped with a flat diamond punch. Stressstrain curves of the thin films were obtained from such tests. Nanoindentation tests were then conducted to compare the results on the same films. Two different metal thin films – AlCuW, AlCuSi with thickness 2 .mu.m and grain size 3.8 .mu.m in average were prepared by PVD method. In this paper, we announce the results of measurements, a comparison of the results obtained by each method and identify advantages and limitations of the methods.
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FITTING OF ELASTIC MODULUS ON THE INTERFACE BETWEEN TWO MATERIALS
Kocmanová, Lenka ; Materna, A. ; Haušild, P. ; Matějíček, Jiří
The paper is aimed to determinate of Young modulus near a sharp interface. The 3D elastic numeric model was used for prediction of the Young modulus. The simulated specimen was composed of tungsten and steel. The interface was plane which a normal vector was perpendicular to the indentation force. The indenter geometry for which numerical solutions were accomplished was a rounded cone indenter. An indentation depth is studied as function of a distance indenter-interface. The distance was normalized by depth of indentation. All values of Young modulus lay on one curve after distance normalization due to elasticity. The curve was fitted by inverse beta function. The curve determine the size of area of one material influenced by a second material.
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Analytical electron microscopy of lead-free nanopowder solders
Buršík, Jiří ; Sopoušek, J. ; Zálešák, Jakub ; Buršíková, V.
During the last decade, the EU legislative regulations enforced lead-free solders and hence initiated an extensive search for the best replacement of lead-containing solders. Parallel to new binary and ternary bulk solders, metal nanoparticles are also considered as potential candidates for solder materials. It is known that physical, electric and thermodynamic properties of nanoobjects are significantly different from those of the bulk materials. The oxidation, high reactivity of the surfaces and aggregation are frequent problems of nanotechnology applications. The nanoparticles of pure metals and alloys exhibit the depression of the melting point compared to bulk material, hence they are able to aggregate and to form firm interlayer joints at low temperatures. Exploiting this effect can save energy, work and materials.
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