Original title: Analytical electron microscopy of lead-free nanopowder solders
Authors: Buršík, Jiří ; Sopoušek, J. ; Zálešák, Jakub ; Buršíková, V.
Document type: Papers
Conference/Event: NANOCON 2010. International Conference /2./, Olomouc (CZ), 2010-10-12 / 2010-10-14
Year: 2010
Language: eng
Abstract: During the last decade, the EU legislative regulations enforced lead-free solders and hence initiated an extensive search for the best replacement of lead-containing solders. Parallel to new binary and ternary bulk solders, metal nanoparticles are also considered as potential candidates for solder materials. It is known that physical, electric and thermodynamic properties of nanoobjects are significantly different from those of the bulk materials. The oxidation, high reactivity of the surfaces and aggregation are frequent problems of nanotechnology applications. The nanoparticles of pure metals and alloys exhibit the depression of the melting point compared to bulk material, hence they are able to aggregate and to form firm interlayer joints at low temperatures. Exploiting this effect can save energy, work and materials.
Keywords: nanoindentation; nanopowder; solder
Host item entry: NANOCON 2010. 2nd International Conference, ISBN 978-80-87294-19-2

Institution: Institute of Physics of Materials AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0228233

Permalink: http://www.nusl.cz/ntk/nusl-166321


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