National Repository of Grey Literature 214 records found  previous11 - 20nextend  jump to record: Search took 0.02 seconds. 
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Modern Assembly for Microelectronic and Electronic Modules
Janík, Pavel ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
Project is focused on describe modern assembly of microelectronic and electronic modules in electronic devices. Sense of the project is analyse reliability and inadequacies electronic devices assembled by modern technogies. Inadequacies modern technologies are impulse for design, implementation and testing new our way of assembly microelectronic modules. Main kind of materials which are used in this project are ceramics Al2O3 and printed circuit board FR4.
Diagnostic system of paper machine
Škrobánek, Martin ; Jankových, Róbert (referee) ; Zuth, Daniel (advisor)
This master thesis deals with the technical diagnostics, focusing mainly on vibration diagnostics. This problematice is described in the first part of this work on a theoretical level. The next part describes the paper machine, diagnostic system and the measuring points are classified into databases. The practical part of this work consists of a proposal for the methodology of vibration diagnostics for a paper machine, the procedure for measuring and evaluating the measured values. Part of the work is also a practical example of the measurement of the central cylinder, on which the procedure is tested, and the compilation of new limit values.
Usage of Modern Methods for Increasing Reliability of Control System Implementations
Szurman, Karel ; Mičulka, Lukáš (referee) ; Kaštil, Jan (advisor)
At avionics control and critical systems is necessary guarantee a minimal level of fault tolerance and their high reliability. On the electronic components in these devices has an undesirable influence environment conditions and mainly cosmic ray. In this paper are described the most common failure types of semiconductor components and devices together with modern methods which can be increased the system fault tolerance and its overall reliability. There are introduced aspects of the avionic systems design due to finally certification and ways to evaluate its safety. This thesis describes design and implementation of the CAN bus control system for the FPGA platform which uses the CANAerospace application protocol. Created system design is improved by the TMR architecture. Fault tolerance of both system version is tested by the SEU framework which allows using the dynamic partial reconfiguration generate an SEU failures into running FPGA design.
Modern avionics system architecture for EASA CS-23 airplane
Vaňousová, Jana ; Hlinka, Jiří (referee) ; Janhuba, Luboš (advisor)
This master thesis covers with the modern architecture of avionics system for EASA CS-23 AIRPL. The thesis contains EASA CS-23 and EU-OPS analysis and market analysis of avionics systems for this category of aircrafts. The thesis also includes the design of avionics system architecture and its safety and reliability assessment – used tool is Failure Mode and Effect Analysis (FMEA). At the end of the thesis there is assesment of potential attack of the avionics system by third part.
Reliability of Lead-free Solders and the Selected Methods to Estimate its Lifetime
Švecová, Olga ; Kolařík, Vladimír (referee) ; Urbánek,, Jan (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on reliability of lead-free solder SAC 305. Knowledge in the field of fatigue models used in determining the lifetime of solder joints are observed in this thesis. Also such methods of predicting reliability as numerically-analytical methods or reliability experimental tests are mentioned. Practical results of reliability measurement are presented. Experimental data served as the foundation for determining empirical coefficients for the fatigue model based on deformation induced by creep of the solder, which was implemented in the ANSYS environment. Results from different methods were compared and conclusions discussing the suitability of the presented prediction methods are formulated.
Reliability Analysis of Steel Columns with Encased Web in High Strength Concrete under Compression
Puklický, Libor ; Krejsa,, Martin (referee) ; Melcher, Jindřich (referee) ; Kala, Zdeněk (advisor)
The presented paper deals with a theoretical analysis of the ultimate limit state. The results of experimental research carried out at the Institute of Metal and Timber Structures headed by Assoc. Prof. Karmazinová and Professor Melcher were applied. The geometrically and materially nonlinear solution based on the Timošenko’s solution is verified by the FEM model in the computer programme system ANSYS. The random influence of initial imperfections is taken into consideration. The FEM model also includes the influence of residual stress. In the parametric study, the influence of residual stress on the cross-section plastification is researched into, its influence on the load carrying capacity limit is, together with the influence of other imperfections, the subject of the stochastic analysis, applying the Latin Hypercube Sampling (LHS). Further on, the study proves a direct effect of the concrete part of the cross-section (combination of materials steel-concrete) on the decrease of load carrying capacity limit of the beam caused by influence of the residual stress of steel. With regard to the importance of time dependent phenomena of the concrete creep for the load carrying capacity, the studies given in the Ph.D. thesis are oriented in this respect. The parametric studies of the influence of the concrete creep having applied the Standard Eurocode 2 provide both a comparison of load carrying capacity limits when using common and high-strength concrete types, and also the variability of load carrying capacities. It follows from the comparison of the statistical analysis outputs according to the design reliability conditions of the Standard EN1990 and of the approach of Eurocode 4 that the Eurocode 4 can be recommended for dimensioning of this member type. According to the studies which we carried out, the design in compliance with Eurocode 4 can be evaluated as the reliable one. A larger set of experimental data is necessary to determine the economy.
Probabilistic modeling of shear strength of prestressed concrete beams: Sensitivity analysis and semi-probabilistic design methods
Novák, Lukáš ; Doležel, Jiří (referee) ; Novák, Drahomír (advisor)
Diploma thesis is focused on advanced reliability analysis of structures solved by non--linear finite element analysis. Specifically, semi--probabilistic methods for determination of design value of resistance, sensitivity analysis and surrogate model created by polynomial chaos expansion are described in the diploma thesis. Described methods are applied on prestressed reinforced concrete roof girder.
Reliability analysis of substance measurements using biosensors - limit of detection robust method design
Láznička, Jan ; Brno, Karel Lacina, MU (referee) ; Grosmanová, Zuzana (advisor)
Detection limit of any method is affected by device (electronics, noise), evaluation, software (timing inaccuracy, rounding mistakes, errors determination of parameters using measured values by numerical methods) and by a chemical reaction (diluting errors, the reaction mixture design, chemical interferents, temperature, the accuracy of pipetting). In this work was proposed a metod for determination of detection limit for measuring of inhibitors of acetylcholine esterase by biosensor analysator of toxicity (BTA). The analysator was developed by BVT Technologies a.s. in 2004. To determine the exact detection limit a calibration of output signal was done. Presently the analysator is able to detect only presence of toxins, not their concentration. Not least are mentioned all founded errors of software, which are continuously eliminated.
Cooling effect on growth of intermetallic compounds in lead-free solder joints
Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
This work deals with issues of process optimalization of lead-free soldering. The aim of this work is demonstrate of cooling on grow intermetallic layers during lead-free solde ring process and a hold intensity of cooling on joint quality. The experiment was performed with two types of solder pastes: Sn/Ag/Cu a Sn/Bi/Zn. The final samples were appraised in light of wet-ting, size of intermetallic layers, optical estimation solder and sudar stress test.

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