|
|
Development of Nanofabrication Methodology for Study of Mechanical Properties of Thin Films using Focused Ion Beams
Kuběna, Ivo ; Švejcar, Jiří (referee) ; Kruml, Tomáš (advisor)
The main goal of this work is to find a methodology of the fabrication of microcompressive specimens (pillars) from thin metallic film prepared by means of PVD. The studied film was prepared by the ON Semiconductor company, Roznov pod Radhostem. Its chemical composition was Al-1.5 wt.% Cu; such films are used for electric connections on integrated circuits. At first, a thin intermediate layer of W-10 wt.% Ti was deposited on the Si single crystalline substrate with the purpose of improving adhesion properties of the studied film. The geometry of the microcompressive specimen should be as close to the cylindrical shape as possible. The height of the cylinder is given by the film thickness, its diameter is approximately 1 m. Such specimens were prepared in Quanta 3D FEG Dual BeamTM facility using focused ion beams technology. Experiments were done at FEI Company in Brno. In total, 39 microcompressive specimens were prepared at various ion milling conditions. The required geometry was finally attained by the optimization of processing parameters, in particular the parallelism of lateral faces was improved, the bottom of the removed zone in the vicinity of the pillar was almost flat and the transition pillar – flat bottom was regular. The prepared pillars are suitable for the microcompression tests; the first of them have been already performed within the cooperation with the Institut of Physics, Academy of Sciences of the Czech Republic, Praha.
|
|
|
Development of Nanofabrication Methodology for Study of Mechanical Properties of Thin Films using Focused Ion Beams
Kuběna, Ivo ; Švejcar, Jiří (referee) ; Kruml, Tomáš (advisor)
The main goal of this work is to find a methodology of the fabrication of microcompressive specimens (pillars) from thin metallic film prepared by means of PVD. The studied film was prepared by the ON Semiconductor company, Roznov pod Radhostem. Its chemical composition was Al-1.5 wt.% Cu; such films are used for electric connections on integrated circuits. At first, a thin intermediate layer of W-10 wt.% Ti was deposited on the Si single crystalline substrate with the purpose of improving adhesion properties of the studied film. The geometry of the microcompressive specimen should be as close to the cylindrical shape as possible. The height of the cylinder is given by the film thickness, its diameter is approximately 1 m. Such specimens were prepared in Quanta 3D FEG Dual BeamTM facility using focused ion beams technology. Experiments were done at FEI Company in Brno. In total, 39 microcompressive specimens were prepared at various ion milling conditions. The required geometry was finally attained by the optimization of processing parameters, in particular the parallelism of lateral faces was improved, the bottom of the removed zone in the vicinity of the pillar was almost flat and the transition pillar – flat bottom was regular. The prepared pillars are suitable for the microcompression tests; the first of them have been already performed within the cooperation with the Institut of Physics, Academy of Sciences of the Czech Republic, Praha.
|
|
|
A Comparison of Different Measurement Method of Mechanical Properties of Al Thin Film
Truhlář, M. ; Buršíková, V. ; Sobota, Jaroslav ; Kruml, Tomáš
The paper compares two different methods for testing of metallic thin films: microcompression test and nanoindentation. Microcompression test is one possibility how to perform mechanical tests on a very small scale. This method requires preparation of a small cylindrical specimen (micropillar) of micrometric size by FIB and execution of a compression test using nanoindenter device equipped with a flat diamond punch. Stressstrain curves of the thin films were obtained from such tests. Nanoindentation tests were then conducted to compare the results on the same films. Two different metal thin films – AlCuW, AlCuSi with thickness 2 .mu.m and grain size 3.8 .mu.m in average were prepared by PVD method. In this paper, we announce the results of measurements, a comparison of the results obtained by each method and identify advantages and limitations of the methods.
|
|
| |
|
|
Determination of mechanical properties from microcompression test
Truhlář, Michal ; Kruml, Tomáš ; Kuběna, Ivo ; Petráčková, Klára ; Náhlík, Luboš
This paper describes a microcompression test of Al - 1.5 wt. % Cu thin film deposited on Si substrate. Microcompression combines the sample preparation with the use of ion focused beam (FIB) with a compression test carried out using nanoindenter. Cylindrical specimens (pillars) were prepared using FIB. The diameter of pillars was about 1.3 μm and their height was about 2 μm (equal to the film thickness). Stress-strain curves of the thin film were obtained. The results depend on crystallographic orientation of pillar. The paper is focused to an attempt to determine as precisely as possible Young modulus of the film using experimental data and finite element modelling.
|
|
|
Estimation of mechanical properties of thin Al surface layer
Petráčková, Klára ; Kuběna, Ivo ; Truhlář, Michal ; Náhlík, Luboš ; Kruml, Tomáš
The paper describes a new method for testing of thin layers, so-called microcompression test. As an example determination of Al thin film properties deposited on Si substrate is introduced in the paper. Microcompression combines the sample preparation with the use of focused ion beam (FIB) with a compression test carried out using nanoindenter. Cylindrical specimens (pillars) were prepared in Al film using FIB. The typical diameter of pillars was about 1.3 μm and their height was about 2 μm. The results depend on crystallographic orientation of pillar. Stress-strain curves of the thin film were obtained. Experimentally measured data on pillars needs correction to obtain undistorted material properties of Al thin film. A necessary correction using finite element modeling is suggested in the paper. The paper contributes to a better characterization of very thin surface layers and determination of their mechanical properties.
|
guest ::
