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Operations proposal for the packaging of auto lights used in private vehicles
Palacký, Vladislav ; Neužil, Karel (referee) ; Kubík, Roman (advisor)
The aim of this master thesis is to propose a new operation arrangements for the packaging of auto lights used in private vehicles. For this solution had been used a theoretical knowledge from large areas of logistics, production management, lean manufacturing methodologies, and even the practical experience and knowledge of the particular conditions of the company. Conducted research has detected a critical areas in the company and there was designed a system to remove them. The results of this study allow implementing certain measures, which will improve the company efficiency and increase its competitiveness.
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The Study Logistics Concepts in International Trade
Slámová, Veronika ; Ing.Pavel Holek (referee) ; Jurová, Marie (advisor)
This thesis deals with logistics concepts in international trade in Holek Production Company, which is engaged in the manufacture of steam ironers. Thesis described based on theoretical knowledge and evaluted logistics concept for export steam ironers in the USA. Thesis proposed the alternative for packaging produckt and recommended transport company for export steam ironers.
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Proposal of Business Expansion – Building-up of Packaging Unit
Prosecká, Romana ; Hos, Michal (referee) ; Mikulec, Luděk (advisor)
The topic of the thesis is Proposal of Business Expansion - Building-up of Packaging Unit. The proposal is based on the analysis of the current production capacity and production equipment, and on the analysis of money management and ascertained shortcomings. On the basis of the carried out analysis a proposal for building-up of a new production unit and a recommendation on purchase of new machine equipment has been made. A calculation of investment costs is a part of the proposal.
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Study of a Logistic Concept Focusing on the Packaging Economy
Šatera, Martin ; Píša, Petr (referee) ; Jurová, Marie (advisor)
This bachelor thesis focuses on implementation of returnable packaging to supply chain of plastic material from czech suppliers in company MANN + HUMMEL (CZ) v.o.s. In the first part of the thesis theoretical aspects of packaging management in companies will be described. The next part analyses current situation in company MANN + HUMMEL (CZ) v.o.s. regarding purchased plastic components from czech suppliers packaging management (costs calculation). Following are suggestions regarding process improvement by implementing returnable packaging to purchased plastic components from czech suppliers supply chain and preliminary cost calculation in case the implementation is carried out.
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Reverse logistics of packaging in company
Marková, Tereza ; Kuba,, Karel (referee) ; Milichovský, František (advisor)
The bachelor thesis is focused on the reverse logistics in company Tierra Verde. It specifies process of collection and the following loading of packaging. The thesis provides an analysis of how manufacture company focused on ecology deal with issues regarding trade with packaging. The aim of this thesis is to analyze the process of reverse logistics in company and to introduce improvements and suggestions for such process.
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Modern methods for Chip Attach
Nešpor, Dušan ; Novotný, Marek (referee) ; Szendiuch, Ivan (advisor)
The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different thermal and mechanical properties of used materials. Work contains modeling with program ANSYS and practical tests with testing packages. Determining a place in the solder with the maximal and the minimal stress values and determining of the stress distribution for all materials are the results of this research.
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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Advancing Packiging and 3D systems
Nicák, Michal ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.
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Analyze of Packaging Impact on Insulating properties
Pulec, Jiří ; Hejátková, Edita (referee) ; Szendiuch, Ivan (advisor)
Modern analog systems processing signals with very small amplitude are prone to distortion, which is caused by leakage between signal traces. Causation of this is contamination of insulating gap, which insulates these traces. Goal of this thesis is to design and manufacturing of test structure, which allows classification of influence of contamination on substrate on leakage, and another goal is classification of technologiacal processes in light of contamination of substrate with electroactive inpurities. Based on results of this experiments are defined rules leading to optimizing of properties of manufactured structures. Attention is applied to ceramic substrates with conductive traces which are created with thick film technology.
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