National Repository of Grey Literature 29 records found  beginprevious20 - 29  jump to record: Search took 0.00 seconds. 
The pressure measuring using LTCC technology
Straka, Michal ; Řezníček, Michal (referee) ; Kosina, Petr (advisor)
This thesis deals with the problems of the pressure sensor made on a low temperature co-fired ceramics. The pressure sensor converts the measured physical quantity to the electrical signal. The strain-gauge, capacitive and optical sensors are used for scanning of the pressure. It is possible to construct the multilayer sensors with holes and cutouts, through the use of the 3D structure on LTCC sensors. The passive parts can be applied on this layer through the thin-layer or thick-layer technology, which creates conductible paths and contacts for parts and outlets. In the practical part of the work, a few construction types of pressure sensors are designed, implemented and measured. Emphasis is given to strain-gauge strip sensor and possible problems during its manufacture, lamination and deformation of burn-out.
Non-Conventional Applications of Low-Temperature Co-Fired Ceramics
Klíma, Martin ; Mach, Pavel (referee) ; Pietriková, Alena (referee) ; Szendiuch, Ivan (advisor)
The doctoral thesis is aimed at research of application possibilities of low-temperature co-fired ceramics, especially its non-conventional usage. It deals with particular topics ensue from electronic chips package design. The thesis also touches optoelectronic sensor application of this ceramics.
Planar Circuits Elements on Low Temperature Cofired Ceramics
Kosina, Petr ; Dřímal, Jiří (referee) ; Kolařík, Vladimír (referee) ; Šandera, Josef (advisor)
The present work deals with the design and manufacturing of 3D structures in LTCC (Low Temperatue Cofired Ceramics) technology. To use this technology LTCC workplaces have been designed and technological processes for high quality reproducible production were suggested. Technological possibilities of low temperature co-fired ceramics were demonstrated in the design and manufacturing of pressure sensors, electrode systems for ozone generators, planar circuit elements (coils and transformers) and in the design a special package for middle-power terahertz modulator. Design of selected parts of respective devices was proved by simulations in COMSOL Multiphysics. The work provides new insights into the structure of power integrated circuits sleeves and structure of electrode systems for different types of electrical discharges. Results of this work can contribute significantly in the application of planar circuit elements, in the development of different types of sensors, in the design of atypical types of packaging or in the design of electrode systems for capacitive coupled electrical discharges.
Pressure sensor made 3D structure
Hanus, Martin ; Pekárek, Jan (referee) ; Kosina, Petr (advisor)
This thesis deals with the points at issue of a 3D structure pressure sensor. The pressure sensor converts pressure into another physical quantity which is easier measure and which is processed subsequently. Usually ways of pressure sensing is for example capacitive, strain-gauge and optical. The 3D structures are constructed through the use of a LTCC technology, which can be laminated to create multi-layer structures, compared to standard high-temperature ceramics. Passive circuit components can be applied onto particular ceramic layers using either thin-layer or thick-layer technology. Practice part of thesis deals with several ways of construction a pressure sensor. First of all capacitive, strain-gauge and optical sensor and possible problems with construction individual sensors above all problems with lamination, cavity or burning
Termomechanical reliability soldered connections in electronic
Novotný, Václav ; Psota, Boleslav (referee) ; Šandera, Josef (advisor)
The diploma thesis deals with the sphere of solder joints reliability. The narrower focus is use of lead-free solder alloy SAC305 in the production process and parameters of its reliability. The text describes the main factors, which have the influence on the reliability of solder joints under conditions of thermal cycling. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to estimating the reliability of soldered connections and are listed the fatigue model to estimate reliability. These fatigue models are categorized based on different physical mechanisms that operate in the soldered joints during operation. Based on the comparison of different models is selected the most appropriate model and in conjunction with simulation in ANSYS is estimated reliability. For this purpose is selected soldered connection of the FR-4 substrate and ceramic substrate via SMD component. They are manufactured test kits and subjected to conditions of temperature cycling. Results obtained from experimental measurements are compared with results obtained by simulation and calculation.
Application of Thick Films in the Modern Electronics
Somer, Jakub ; Urban, František (referee) ; Szendiuch, Ivan (advisor)
Tato diplomová práce se zabývá technologií tlustých vrstev a jejím možným použitím pro nekonvenční aplikace. První část práce je rešeršní a zaměřuje se především na aplikace tlustovrstvé technologie v různých oblastech použití. V teoretické části práce je dále popsána technologie LTCC, včetně technologických postupů výroby. V praktické části jsou řešeny dvě aplikace v tlustovrstvé technologii. Jedná se návrh a výrobu vysokofrekvenčního filtru a optického senzoru tlaku technologií LTCC. V závěru práce jsou provedena měření a jsou zhodnoceny dosažené výsledky.
The lamination of Low Temperature Co-fired Ceramic
Hudeček, Ondřej ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
Master’s thesis deals with the optimalization of low-temperature cofired ceramic lamination process that affects the final quality of 3D structures (eg., channels, cavities, membranes, etc.). The paper evaluates the influence of lamination parameters (pressure, temperature, time) on the formation of defects in the structure, which were detected by appropriate methods. The last parts describes designed and simulation cooling water system using LTCC technology.
Liquid analysis sensor
Hanus, Martin ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with the mixing of liquids issues. The simulation of structure for mixing of liquids and evaluation of parametres which have most significant influence on mixing of liquids was made with help of COMSOL programm. In the next section of thesis the quality of electrodes used for cyclic voltammetry made on LTCC by thick layer technology was determined. In the end of this thesis the 3D structure for mixing of liquids was made. The quality of mixing was controlled by cyclic voltammetry.
Thermomechanical reliability of solder connection in electronic modules with LTCC
Krajíček, Michal ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.
The system for measurement of little flow
Karásek, Eduard ; Prášek, Jan (referee) ; Adámek, Martin (advisor)
Diploma thesis solves how to create system for measurement of little liquid flows. The basic types of liquid flowmeter, which are possible used for measurement of little liquid flows, are described in the introduction part of thesis. The limit for little flow is often determined as flow 100 mg.min-1 and low. Second part of this thesis describes the ways of capillary production and practical experiments with them. Thesis is focused to thick film technology and LTCC technology. Next part of this work is solution of simple measuring unit for measurement of little flows less than 100 mg.min 1, which is controlled by microprocessor ATmega16. The measuring unit can be worked separately or can be connected to PC. The next possibility of flowmeter optimisation is summarized in end of thesis.

National Repository of Grey Literature : 29 records found   beginprevious20 - 29  jump to record:
Interested in being notified about new results for this query?
Subscribe to the RSS feed.