Original title: Termomechanická spolehlivost pájených propojení v elektronice
Translated title: Termomechanical reliability soldered connections in electronic
Authors: Novotný, Václav ; Psota, Boleslav (referee) ; Šandera, Josef (advisor)
Document type: Master’s theses
Year: 2014
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: ANSYS; fatigue model; lead-free solder; LTCC; reliability; solder joint; ANSYS; bezolovnatá pájka; LTCC; pájený spoj; spolehlivost; únavový model

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/32186

Permalink: http://www.nusl.cz/ntk/nusl-220997


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2016-06-03, last modified 2022-09-04


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