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QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
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The options of the joining of tube components
Holusek, Maxmilián ; Štroner, Marek (referee) ; Peterková, Eva (advisor)
The bachelor thesis deals with tube components joining methods. In the thesis, the preparation of the tube components is mentioned, as well as its tools and machines for cutting and adjusting the components. Furthermore, the work introduces several joining methods such as soldering and brazing, welding, pressing technology, adhesive bonding and threaded connection. The basic principle is described for each method, as well as using tools and machines plus advantages and disadvantages. In the end, the use of tube components is presented.
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Unconventional Metals Hardsurfacing Technologies
Krejčí, Vojtěch ; Šárka,, Šimůnková-Houdková (referee) ; Čelko, Ladislav (advisor)
The main objektive of the bachelor thesis is to evolve problems of metalic surface welding and to implement the basic partition of the most expanded used technologies of surface welding. Sometimes we can see the term deposition metalic surface welding too but in practice is used technical term metalic surface welding. The introdution includes the basic acquaintance with problems and the characterization of the proces of surface welding including the summary of its advantages and disadvantages. In other chapters we aim on individual technologies of surface welding, its principle and using in technical practice. Simultaneously is worked out the overview of already unused or minimally used technologies of surface welding. After the presentation of individual technologies follows the section dealing with partition of materials used for surface welding by the basic material as well as surface welding materials at the present technical practice. In the experimental section of thesis follows selected examples of using the presented technologies of surface welding in practice at present.
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Modification of PCB cleaning process after removing BGA component
Procházka, Adam ; Bžoněk, Tomáš (referee) ; Řezníček, Michal (advisor)
This bachelor thesis deals with the modification of DPS cleaning process after the removal of BGA components. The thesis is divided into five main parts including the introduction and conclusion. The introduction comprises an assignment and aim of the thesis. The first, theoretical, part then deals with different kinds of soldering, individual types of solders and the rework process itself. The second part examines the whole practical part in detail, from the proposal of the test printed circuit board to its mounting, soldering and subsequent testing. Also, it explains the practical tests for connectors. The third part then describes the board testing by thermal cycling. The last part consists of the summary of results, a comparison of individual soldering pastes and conclusion.
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Design of Digital Soldering Station
Matušková, Adéla ; John, David (referee) ; Rubínová, Dana (advisor)
The subject of this Bachelor’s Thesis is a design of a digital soldering station, which is defined for amateurs, but also for professionals. The aim is to design a soldering station following user´s comfort, safety and technological and structural requirements. This project includes the analysis of current products, deals with entered aims of the work and describes the final solution.
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Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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Mini reflow oven
Pavelka, Radek ; Jelínek, Aleš (referee) ; Burian, František (advisor)
This thesis is aimed to design a small oven for PCB soldering using the reflow method. It contains description of the oven’s construction, it’s thermodynamic parameters and the design of the control and power unit PCB as well as their control software. A remote PC control and monitoring application is also a part of this thesis.
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Rework and Repair Procedures of Selected Components and LED on Various Types of PCBs.
Pospíšil, Tomáš ; Ondřej, Klemš (referee) ; Starý, Jiří (advisor)
This work deals with technology of rework and repairs of electronic soldering assemblies. The work is primarily focused on the rework and repairs of electronic soldering assemblies with the light emitting diode. The theoretical part describes the technological methods of soldering and reworking of electronic assemblies, their diagnostics, evaluation of their influence on reliability and functional properties. The practical part is focused on the real application of technological procedures of rework and repairs, their testing and evaluation. Furthermore there is described and tested the influence of thermal load during soldering on the properties of light emitting diodes.
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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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