Original title: Modelování technologických kroků kontaktování čipu mikrodrátkem
Translated title: Modeling of wirebonding technological steps for chip connection
Authors: Houserek, Jiří ; Kosina, Petr (referee) ; Psota, Boleslav (advisor)
Document type: Master’s theses
Year: 2013
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: Ansys; chips contacts; simulations; Wire-bounding; Ansys; kontaktování čipů; simulace; Wire-bonding

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/27100

Permalink: http://www.nusl.cz/ntk/nusl-552560


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2024-04-02, last modified 2024-04-03


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