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Optimization of deep reactive ion etching process
Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
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Microelectromechanical through-silicon vias
Dulák, Radovan ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
Through-hole silicon vias are key technology enabling 3D system integration and thus creating compact devices. These vertical microstructures interconnect multiple layers and are also used in integrated circuits and MEMS devices. This bachelor‘s thesis focuses on the possibility of preparing these microjunctions by wet anisotropic etching and dry anisotropic etching using the deep reactive ion etching (DRIE) process for use in MEMS. The work shows preparation, etching, plating and galvanic filling of these structures. Using optical and scanning electron microscope (SEM) images, experimental tests and subsequent optimization were performed and evaluated to create a hole with a minimum size of approximately 1 m using a wet etching process and 16 m by a dry etching process. The highest achieved aspect ratio on a wafer was 15:1. In addition, the created holes were plated, galvanically filled with conductive material and electrically tested and measured.
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Gecko Mimicking Surfaces
Fecko, Peter
Adhesive capabilities of a gecko lizard have been the subject of many studies and an inspiration for many artificial imitations and inventions. This work proposes a design of synthetic gecko mimicking structures in a form of micro-pillars, that would have similar adhesion capabilities as gecko setae. Structures made of Parylene C have been created using photolithography and silicon etching methods. Following focus will be on various surface modifications and characterisation of these structures to determine the adhesion forces present.
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Optimization of deep reactive ion etching process
Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
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