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System for Supporting Communication of Agile Project Management
Krajíček, Michal ; Bartík, Vladimír (referee) ; Kreslíková, Jitka (advisor)
The thesis deals with problems of agile methodologies in the settings of virtual teams. It begins with the description of virtual teams and their models and deals with both theoretical and practical aspects of mutual communication of their team members. The thesis follows with general characteristics of agile approach and their demonstration on representative methodologies. One of them (methodology Scrum) is described in detail in the next chapter and linked with possibilities of its deployment within virtual teams. Practical part of the thesis deals with the design and implementation of a software application that is focused on effective communication support of virtual teams that utilize Scrum. Deployment of this application is discussed within a case study of a real project which team faced problems of agile software development in the settings of virtual team on a daily basis.
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VoIP Quality Analyzer
Krajíček, Michal ; Žádník, Martin (referee) ; Tobola, Jiří (advisor)
This thesis deals with the quality of the IP telephony and its measuring using the netflow technology. It describes individual factors influencing the quality from sampling and quantization over the impairment caused by codecs to the degradation during network transfers. Next part focuses on models allowing to regard quality of IP telephony with emphasis to the E-model and R-factor. It shortly describes the netflow technology and the quality measuring connected with it. Practical part describes the principle of how the quality is measured by the netflow probe nProbe together with offer and implementation of application measuring the quality. The comparison with commercial application is presented and the results are discussed.
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Thermomechanical reliability of solder connection in electronic modules with LTCC
Krajíček, Michal ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.
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Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
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System for Supporting Communication of Agile Project Management
Krajíček, Michal ; Bartík, Vladimír (referee) ; Kreslíková, Jitka (advisor)
The thesis deals with problems of agile methodologies in the settings of virtual teams. It begins with the description of virtual teams and their models and deals with both theoretical and practical aspects of mutual communication of their team members. The thesis follows with general characteristics of agile approach and their demonstration on representative methodologies. One of them (methodology Scrum) is described in detail in the next chapter and linked with possibilities of its deployment within virtual teams. Practical part of the thesis deals with the design and implementation of a software application that is focused on effective communication support of virtual teams that utilize Scrum. Deployment of this application is discussed within a case study of a real project which team faced problems of agile software development in the settings of virtual team on a daily basis.
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|
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VoIP Quality Analyzer
Krajíček, Michal ; Žádník, Martin (referee) ; Tobola, Jiří (advisor)
This thesis deals with the quality of the IP telephony and its measuring using the netflow technology. It describes individual factors influencing the quality from sampling and quantization over the impairment caused by codecs to the degradation during network transfers. Next part focuses on models allowing to regard quality of IP telephony with emphasis to the E-model and R-factor. It shortly describes the netflow technology and the quality measuring connected with it. Practical part describes the principle of how the quality is measured by the netflow probe nProbe together with offer and implementation of application measuring the quality. The comparison with commercial application is presented and the results are discussed.
|
|
|
Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
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|
|
Thermomechanical reliability of solder connection in electronic modules with LTCC
Krajíček, Michal ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.
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