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An apparatus with a horizontal capillary tube intended for measurement of the surface tension of supercooled liquids
Vinš, Václav ; Hošek, Jan ; Hykl, Jiří ; Hrubý, Jan
New experimental apparatus for measurement of the surface tension of liquids under the metastable supercooled state has been designed and assembled in the study. The measuring technique is similar to the method employed by P.T. Hacker [NACA TN 2510, 1951]. A short liquid thread of the liquid sample was located in a horizontal capillary tube partly placed in a temperature-controlled chamber. One end of the capillary tube was connected to a setup with inert gas which allowed for precise tuning of the gas overpressure. The open end of the capillary tube was precisely grinded and polished in order to assure its planarity and perpendicularity. The liquid meniscus at the open end was illuminated by a laser beam and observed by a digital camera. Application of an increasing overpressure of the inert gas at the inner meniscus of the liquid thread caused variation of the outer meniscus such that it gradually changed from concave to flat and subsequently convex shape. The surface tension at the temperature of the inner meniscus could be evaluated from the overpressure corresponding to exactly planar outer meniscus.
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Microstructuring of metallic layers for sensor applications
Kolařík, Vladimír ; Krátký, Stanislav ; Urbánek, Michal ; Matějka, Milan ; Chlumská, Jana ; Horáček, Miroslav
This contribution deals with a patterning of thin metallic layers using the masking technique by electron beam lithography. It is mainly concentrated on procedures to prepare finger structure in thin Gold layer on electrically isolated Silicon wafer. Both positive and negative tone resists are used for patterning. The thin layer is structured by the wet etching or by the lift-off technique. The prepared structures are intended to be used as a conductivity sensor for a variety of sensor applications. Patterning of the thin layer is performed by the e-beam writer with shaped rectangular beam BS600 by direct writing (without the glass photo mask). Besides the main technology process based on the direct-write e-beam lithography, other auxiliary issues are also discussed such as stitching and overlay precision of the process, throughput of this approach, issues of the thin layer adhesion on the substrate, inter-operation control and measurement techniques.
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