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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
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Study of BGA and QFN package properties
Skácel, Josef ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution. First part deals with analysis of the current status of packages. Next part is analyze the issue of heat transfer in electronic systems. The following section is an experimental dealing with simulation in ANSYS Workbench and validation of these simulations by designed test structures. At the end is evaluated properties and behavior of these packages.
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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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