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Transparent and semi-transparent thin films for bioelectronics
Jarušek, Jaromír ; Fohlerová, Zdenka (referee) ; Gablech, Imrich (advisor)
This thesis is focused on the development of transparent microelectrode arrays for bioelectronic interfaces with electrogenic cells. The main area of interest is in vitro applications suitable for the observation of living cells using an inverted optical microscope. The theoretical part further discusses different types of transparent and semitransparent electrically conductive materials including gold-based thin films, titanium nitride, carbon-based layers, conductive oxides, and conductive polymers. The experimental part is focused on the process optimization of indium tin oxide (ITO) magnetron sputtering and stressing of TiN-ITO thin films using chemical and electrochemical techniques. The last part is focused on the design, manufacturing, and testing of planar microelectrode arrays made of different electrode materials.
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Sputtering of nitride layers using Kaufman ion-beam source for bioelectronics applications
Jarušek, Jaromír ; Chmela, Ondřej (referee) ; Gablech, Imrich (advisor)
In this work, nitride layers, their applications in bioelectronics, and methods of chemical vapour deposition and physical vapour deposition are presented. The focus of this work is the preparation of titanium nitride thin films by reactive sputtering using Kaufman ion-beam sources. Thin films were deposited on silicon wafers and microslides. Deposited titanium nitride thin films are characterized by X-ray diffraction, four-point probe sheet resistance measurement and profilometry to determine residual stress.
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Sputtering of nitride layers using Kaufman ion-beam source for bioelectronics applications
Jarušek, Jaromír ; Chmela, Ondřej (referee) ; Gablech, Imrich (advisor)
In this work, nitride layers, their applications in bioelectronics, and methods of chemical vapour deposition and physical vapour deposition are presented. The focus of this work is the preparation of titanium nitride thin films by reactive sputtering using Kaufman ion-beam sources. Thin films were deposited on silicon wafers and microslides. Deposited titanium nitride thin films are characterized by X-ray diffraction, four-point probe sheet resistance measurement and profilometry to determine residual stress.
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