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New Areas of the Ultrasonic Application in Microelectronics Technology
Buršík, Martin ; Pietriková, Alena (referee) ; Králová,, Iva (referee) ; Szendiuch, Ivan (advisor)
Doctoral thesis deals with the deposition of special thixotropic materials for microelectronic technology. The aim of the work is the development of the new method optimizing the dosing process in order to achieve a print resolution of better than 100 microns. The work includes the development of a special dispensing head (UZD) using the influence of ultrasonic energy. These results demonstrate the possibility of a newly developed method that is able to print thixotropic materials with a resolution of 65 microns. Compared to other methods achieves these results with the commonly used materials for thick film technology with particle size up to 5 microns.
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Automatization of 3D stacking process
Kamenec, Jan ; Řezníček, Michal (referee) ; Buršík, Martin (advisor)
The task of my thesis was to automate the process of 3D stacking. The work includes design of complex control board, that will serve as a control unit and provide a comprehensive function of mechanical displacement in combination with digital image acquisition. In addition, the electronics for controlling a stepper motor, PCB and the design. The result of this is a facility that provides automatic acquisition of images with different depth of field.
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Optimalization of ultrasonic interconnection
Gregor, Pavel ; Hejátková, Edita (referee) ; Buršík, Martin (advisor)
The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.
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Electrical properties of thick-film resistive pastes
Gajdoš, Jiří ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This work deals with the technology of thick-film electronic circuits, describes the materials used for the implementation of a thick-film circuit and basic operations for their production. The content is also a proposal resistive pattern, which allows measurement of thick-film resistive inks. The practical part describes the creation of resistive pattern, creating measuring station, measurement of values of resistors, measurement temperature coefficient of resistance TCR and interpretation of evaluation.
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The direct writing of thick film pastes
Ištvánek, Jan ; Buršík, Martin (referee) ; Hladík, Jiří (advisor)
This work deals with the problem of the thick-film pastes and their printing. In the main chapter of this work, the realization of a workplace for thick-film pastes' printing is described. The construction of the realized plotter and the controlling electronics of the plotter is depicted in detail.In the following chapter, the console, through which the plotter is controlled via PC, and the CAD program, which serves for projecting of the motives printed, are described.In the final chapter of this work, the measured profiles of the paste printed for various settings of printing parameters and the photographs of the motives printed are stated.
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Monitoring the impact of ultrasonic energy to the leveling of thick film pastes
Pokluda, Tomáš ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This bachelor thesis is focused on the problem of levelling of a profile by ultrasound after printing thick layer pastes and on electrical resistance and geometrical dimensions changes. It describes a creation of hybrid integrated circuits, thick film technology and the screen printing method. It also includes basics of fluid physics, basics of fluid rheology, and description of principles of the used ultrasound transducer. Records of the levelling measurements are presented through the use of photographs, comments, tables and graphs.
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The direct writing of thick film pastes
Ištvánek, Jan ; Řezníček, Michal (referee) ; Buršík, Martin (advisor)
This work deals with the problem of the thick-film pastes and their printing. In the main chapter of this work, the realization of a workplace for thick-film pastes' printing is described. The construction of the realized plotter and the controlling electronics of the plotter is depicted in detail.In the following chapter, the console, through which the plotter is controlled via PC, and the CAD program, which serves for projecting of the motives printed, are described.In the final chapter of this work, the measured profiles of the paste printed for various settings of printing parameters and the photographs of the motives printed are stated.
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The direct writing of thick film pastes
Ištvánek, Jan ; Buršík, Martin (referee) ; Hladík, Jiří (advisor)
This work deals with the problem of the thick-film pastes and their printing. In the main chapter of this work, the realization of a workplace for thick-film pastes' printing is described. The construction of the realized plotter and the controlling electronics of the plotter is depicted in detail.In the following chapter, the console, through which the plotter is controlled via PC, and the CAD program, which serves for projecting of the motives printed, are described.In the final chapter of this work, the measured profiles of the paste printed for various settings of printing parameters and the photographs of the motives printed are stated.
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Electrical properties of thick-film resistive pastes
Gajdoš, Jiří ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This work deals with the technology of thick-film electronic circuits, describes the materials used for the implementation of a thick-film circuit and basic operations for their production. The content is also a proposal resistive pattern, which allows measurement of thick-film resistive inks. The practical part describes the creation of resistive pattern, creating measuring station, measurement of values of resistors, measurement temperature coefficient of resistance TCR and interpretation of evaluation.
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