Original title: Design of a device for measuring the electrical resistance of soldered joints during fatigue tests
Authors: Kopřiva, Pavel ; Otáhal, Alexand
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This document deals with design of device capable of measuring electrical resistance of solder joints during fatigue testing. It contains theory behind fatigue testing, chosen parameters, design, and construction of the measuring device.
Keywords: BGA package; Design; DPS; Fatigue tests; Resistance measurement; Solder joints
Host item entry: Proceedings I of the 30st Conference STUDENT EEICT 2024: General papers, ISBN 978-80-214-6231-1, ISSN 2788-1334

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: https://hdl.handle.net/11012/249221

Permalink: http://www.nusl.cz/ntk/nusl-622559


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers