Original title:
Design of a device for measuring the electrical resistance of soldered joints during fatigue tests
Authors:
Kopřiva, Pavel ; Otáhal, Alexand Document type: Papers
Language:
eng Publisher:
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií Abstract:
This document deals with design of device capable of measuring electrical resistance of solder joints during fatigue testing. It contains theory behind fatigue testing, chosen parameters, design, and construction of the measuring device.
Keywords:
BGA package; Design; DPS; Fatigue tests; Resistance measurement; Solder joints Host item entry: Proceedings I of the 30st Conference STUDENT EEICT 2024: General papers, ISBN 978-80-214-6231-1, ISSN 2788-1334
Institution: Brno University of Technology
(web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library. Original record: https://hdl.handle.net/11012/249221