Original title: Šablonový tisk pájecí pasty a optimalizace procesu pro zvýšení výtěžnosti
Translated title: Stencil Printing of Solder Paste and Process Optimization for Increasing Yield
Authors: Flos, Milan ; Sedlaříková, Marie (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2024
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: AOI; Electro polishing; Nano-coating; Solder Paste; Solder Paste Printing; SPI; stencil; Stencil Printing; AOI; Electro polishing; Nano-coating; pájecí pasta; SPI; Tisk pájecí pasty; šablona; šablonový tisk

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: https://hdl.handle.net/11012/245985

Permalink: http://www.nusl.cz/ntk/nusl-616198


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2024-06-09, last modified 2024-06-09


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