Original title: Studie srovnání vlastností pouzder QFN a BGA
Translated title: Study of BGA and QFN package properties
Authors: Skácel, Josef ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
Document type: Master’s theses
Year: 2015
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: ANSYS Workbench; coefficient of thermal expansion; CTE; Packaging in electronics; packaging materials; thermal simulation; ANSYS Workbench; koeficient teplotní roztažnosti; Pouzdření v elektronice; pouzdřící materiály; teplotní simulace; TKR

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/40254

Permalink: http://www.nusl.cz/ntk/nusl-561368


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2024-04-02, last modified 2024-04-03


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