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Original title:
ELECTROCHEMICAL STUDY OF CuSCN INORGANIC HOLE-TRANSPORT MATERIAL FOR SOLAR CELLS PREPARED BY ELECTRODEPOSITION FROM AQUEOUS SOLUTION
Authors: Vlčková Živcová, Zuzana ; Mansfeldová, Věra ; Bouša, Milan ; Kavan, Ladislav
Document type: Papers
Conference/Event: International Conference NANOCON 2020 /12./, Brno (CZ), 20201021
Year: 2021
Language: eng
Abstract: A comparative study is reported for electrodeposited copper(I) thiocyanate layers (ca. 500 nm) on two types of conductive/semiconductive substrates: i) carbon (boron-doped diamond_BDD, glass-like carbon_GC), and ii) carbon-free F-doped SnO2 conducting glass (FTO). SEM and Raman evidence that electrodeposition from aqueous solution results in homogenous CuSCN layers with dominant thiocyanate ion bounded to copper through its S-end (Cu−SCN bonding), as in spin-coated CuSCN layers. Electrochemical impedance spectroscopy (EIS) confirms the p-type semiconductivity of layers with a flatband potential from 0.1 to 0.18 V vs. Ag/AgCl depending on the substrate type, and the acceptor concentration (NA) of 5 x 1020cm-3 in all cases. The flatband potentials determined from Mott-Schottky plots (EIS) are in good agreement with the Kelvin probe measurements. The blocking quality of CuSCN layers was tested using Ru(NH3)63+/2+ redox probe. CuSCN deposited on BDD substrate exhibits better blocking properties compared to CuSCN deposited on FTO.
Keywords: CuSCN; electrodeposition; hole transport material
Project no.: GA18-08959S (CEP)
Funding provider: GA ČR
Host item entry: Conference Proceedings - NANOCON 2020. 12th International Conference on Nanomaterials - Research & Application, ISBN 978-80-87294-98-7
Institution: J. Heyrovsky Institute of Physical Chemistry AS ČR (web)
Document availability information: Fulltext is available in the digital repository of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0319191
Permalink: http://www.nusl.cz/ntk/nusl-438580
The record appears in these collections:
Research > Institutes ASCR > J. Heyrovsky Institute of Physical Chemistry
Conference materials > Papers
Authors: Vlčková Živcová, Zuzana ; Mansfeldová, Věra ; Bouša, Milan ; Kavan, Ladislav
Document type: Papers
Conference/Event: International Conference NANOCON 2020 /12./, Brno (CZ), 20201021
Year: 2021
Language: eng
Abstract: A comparative study is reported for electrodeposited copper(I) thiocyanate layers (ca. 500 nm) on two types of conductive/semiconductive substrates: i) carbon (boron-doped diamond_BDD, glass-like carbon_GC), and ii) carbon-free F-doped SnO2 conducting glass (FTO). SEM and Raman evidence that electrodeposition from aqueous solution results in homogenous CuSCN layers with dominant thiocyanate ion bounded to copper through its S-end (Cu−SCN bonding), as in spin-coated CuSCN layers. Electrochemical impedance spectroscopy (EIS) confirms the p-type semiconductivity of layers with a flatband potential from 0.1 to 0.18 V vs. Ag/AgCl depending on the substrate type, and the acceptor concentration (NA) of 5 x 1020cm-3 in all cases. The flatband potentials determined from Mott-Schottky plots (EIS) are in good agreement with the Kelvin probe measurements. The blocking quality of CuSCN layers was tested using Ru(NH3)63+/2+ redox probe. CuSCN deposited on BDD substrate exhibits better blocking properties compared to CuSCN deposited on FTO.
Keywords: CuSCN; electrodeposition; hole transport material
Project no.: GA18-08959S (CEP)
Funding provider: GA ČR
Host item entry: Conference Proceedings - NANOCON 2020. 12th International Conference on Nanomaterials - Research & Application, ISBN 978-80-87294-98-7
Institution: J. Heyrovsky Institute of Physical Chemistry AS ČR (web)
Document availability information: Fulltext is available in the digital repository of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0319191
Permalink: http://www.nusl.cz/ntk/nusl-438580
The record appears in these collections:
Research > Institutes ASCR > J. Heyrovsky Institute of Physical Chemistry
Conference materials > Papers
Record created 2021-04-25, last modified 2023-12-06