Original title: Silicon monocrystal wafers ground with various abrasive materials
Authors: Havelková, Martina ; Hiklová, Helena
Document type: Papers
Conference/Event: Scientific and Business Conference SILICON 2010 /12./, Rožnov pod Radhoštěm (CZ), 2010-11-02 / 2010-11-05
Year: 2010
Language: eng
Abstract: The paper describes measuring of silicon wafers surface. Row of samples were made for different purposes in Themis (Rožnov pod Radhoštěm). The measuring were done with Form Talysurf Series 2 apparatus and the dependence on different conditions of cutting and grinding were monitored.
Keywords: abrasive materials; silicon monocrystal
Project no.: CEZ:AV0Z10100522 (CEP), 1M06002 (CEP), KAN301370701 (CEP)
Funding provider: GA MŠk, GA AV ČR
Host item entry: SILICON 2010. 12th Scientific and Business Conference, ISBN 978-80-254-7361-0

Institution: Institute of Physics AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0006343

Permalink: http://www.nusl.cz/ntk/nusl-42553


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Research > Institutes ASCR > Institute of Physics
Conference materials > Papers