Original title: Analýza ternárního materiálu na bázi Cu-Sn-Sb
Translated title: The analysis of Cu-Sn-Sb ternary alloy
Authors: Kučera, Jan ; Doubrava, Marek (referee) ; Jan, Vít (advisor)
Document type: Bachelor's theses
Year: 2020
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta strojního inženýrství
Abstract: [cze] [eng]

Keywords: Cu-Sb-Sn system; experimental semi-liquid extrusion; lead-free solder; phase diagram; bezolovnaté pájky; Cu-Sb-Sn systém; extruze v polotekutém stavu; fázový diagram

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/191808

Permalink: http://www.nusl.cz/ntk/nusl-416600


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2020-08-02, last modified 2022-09-04


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