Original title: Laser treatment of silicon
Translated title: Laserové zpracování z křemíku
Authors: Chmelíčková, Hana ; Lapšanská, Hana ; Hiklová, Helena ; Havelková, Martina ; Pavlíček, Pavel
Document type: Papers
Conference/Event: SILICON 2008. Scientific and Business Conference /11./, Rožnov pod Radhoštěm (CZ), 2008-11-04 / 2008-11-07
Year: 2008
Language: eng
Abstract: [eng] [cze]
Laser technologies in silicon treatment were introduced in article possibilities to break silicon wafers by means of Nd:YAG laser in university laboratory were examined. V článku jsou uvedeny laerové technologie používané při opracování křemíku. Experimenty se zpracováváním křemíkových destiček byly provedeny na Nd:YAG laseru v univerzitní laboratoři.
Keywords: laser treatment; Nd:YAG laser
Project no.: CEZ:AV0Z10100522 (CEP), KAN301370701 (CEP), 1M06002 (CEP)
Funding provider: GA AV ČR, GA MŠk
Host item entry: SILICON 2008. 11th Scientific and Business Conference, ISBN 978-80-254-3278-5

Institution: Institute of Physics AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0169721

Permalink: http://www.nusl.cz/ntk/nusl-39905


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Research > Institutes ASCR > Institute of Physics
Conference materials > Papers