Original title: Design Of Reflow Soldering Station For Reballing Of Bga Packages
Authors: Janiš, Adam
Document type: Papers
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the types of soldering devices are described. The main aim of the experimental part is to design the soldering station and to simulate the heat flow during soldering using SolidWorks Flow Simulation. Final stage of this work is based on verification of designed soldering station and optimization of soldering process.
Keywords: BGA; nitrogen protective atmosphere; reballing; reflow oven
Host item entry: Proceedings of the 24th Conference STUDENT EEICT 2018, ISBN 978-80-214-5614-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/138175

Permalink: http://www.nusl.cz/ntk/nusl-393361


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers