Original title: Analysis of Defects on PCB Using X-RAY, 3D SW CERA and Micro-Sections
Authors: Vala, Martin
Document type: Papers
Language: cze
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg.: modern X-ray defect detection.
Keywords: Analysis; Defect; Void; X-plane; X-ray
Host item entry: Proceedings of the 22nd Conference STUDENT EEICT 2016, ISBN 978-80-214-5350-0

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/83918

Permalink: http://www.nusl.cz/ntk/nusl-383636


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers