Original title:
Analysis of Application Flux and Solder Paste on PCB for BGA Components
Authors:
Toufar, Michal Document type: Papers
Language:
cze Publisher:
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií Abstract:
This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
Keywords:
BGA; flux; repair; solder Host item entry: Proceedings of the 22nd Conference STUDENT EEICT 2016, ISBN 978-80-214-5350-0
Institution: Brno University of Technology
(web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library. Original record: http://hdl.handle.net/11012/83917