Original title: Analysis of Application Flux and Solder Paste on PCB for BGA Components
Authors: Toufar, Michal
Document type: Papers
Language: cze
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
Keywords: BGA; flux; repair; solder
Host item entry: Proceedings of the 22nd Conference STUDENT EEICT 2016, ISBN 978-80-214-5350-0

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/83917

Permalink: http://www.nusl.cz/ntk/nusl-383635


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers