Original title: Thermal cycling and lifetime testing of solar cell's solder joints
Translated title: Teplotní stárnutí a životnost pájených spojů solárních článků
Authors: Jakubka, L. ; Linhart, Jan ; Szendiuch, I.
Document type: Papers
Conference/Event: EDS '06 - Electronic Devices and Systems IMAPS CS International Conference, Brno (CZ), 2006-09-14 / 2006-09-15
Year: 2006
Language: eng
Abstract: [eng] [cze]
This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. There are 36 solar cells which were contacted on 12 substrates. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. 6 substrates will be tested with 1000 cycles and 6 substrates will be tested with 3000 cycles. The cycle is in the range -40°C to 125°C, ramp 10°C/min, dwell 10 min, period 60 min. This is the common test cycle regime used in military applications testing, hence the wide temperature range of the cycle. Článek se zabývá problematikou propojení solárních článků s keramickým substrátem pomocí bezolovnaté pájky. Byla zkoumána kvalita a životnost pájených spojů po dobu 1000 a 3000 teplotních cyklů. Rozsah jednoho teplotního cyklu byl -40°C až 125°C s náběhovou dobou 10 min při ohřevu 10°C/min, doba trvání cyklu byla 60 minut.
Keywords: hermal cycling; lead free solder paste; solar cells
Project no.: CEZ:AV0Z20650511 (CEP)
Host item entry: EDS'06 - Electronic Devices and Systems IMAPS CS International Conference 2006 - Proceedings, ISBN 80-214-3246-2

Institution: Institute of Scientific Instruments AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0141285

Permalink: http://www.nusl.cz/ntk/nusl-36443


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Research > Institutes ASCR > Institute of Scientific Instruments
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