Original title: Analysis of Defects on PCB Using X - Plane Method
Authors: Mlýnek, M.
Document type: Papers
Language: cze
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: Using x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects.
Keywords: analysis; defect; X – plane; X – ray
Host item entry: Proceedings of the 21st Conference STUDENT EEICT 2015, ISBN 978-80-214-5148-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/43003

Permalink: http://www.nusl.cz/ntk/nusl-207194


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers