Original title:
Analysis of Defects on PCB Using X - Plane Method
Authors:
Mlýnek, M. Document type: Papers
Language:
cze Publisher:
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií Abstract:
Using x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects.
Keywords:
analysis; defect; X – plane; X – ray Host item entry: Proceedings of the 21st Conference STUDENT EEICT 2015, ISBN 978-80-214-5148-3
Institution: Brno University of Technology
(web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library. Original record: http://hdl.handle.net/11012/43003