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Original title:
Influence of Microstructure Instability on Creep Behaviour of UFG Pure Materials
Authors: Král, Petr ; Dvořák, Jiří ; Svoboda, Milan ; Kvapilová, Marie ; Sklenička, Václav
Document type: Papers
Conference/Event: Metal 2012, Brno (CZ), 2012-05-23 / 2012-05-25
Year: 2012
Language: eng
Abstract: Experiments were conducted to determine an effect of creep temperature on creep behaviour of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373-573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). The microstructure analyses showed that microstructure of pure Cu processed by 8 ECAP passes and subsequent creep exposure contained large fraction of boundaries with coincidence sites lattice (CSL). The results showed that creep in UFG materials is influenced by additional creep mechanisms up to 0.5 Tm when the UFG microstructure in more or less stable.
Keywords: creep behaviour; EBSD; Ultrafine-grained microstructure
Project no.: CEZ:AV0Z20410507 (CEP), GPP108/10/P469 (CEP)
Funding provider: GA ČR
Host item entry: METAL 2012 Conference Proceedings, ISBN 978-80-87294-31-4
Institution: Institute of Physics of Materials AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0215262
Permalink: http://www.nusl.cz/ntk/nusl-135522
The record appears in these collections:
Research > Institutes ASCR > Institute of Physics of Materials
Conference materials > Papers
Authors: Král, Petr ; Dvořák, Jiří ; Svoboda, Milan ; Kvapilová, Marie ; Sklenička, Václav
Document type: Papers
Conference/Event: Metal 2012, Brno (CZ), 2012-05-23 / 2012-05-25
Year: 2012
Language: eng
Abstract: Experiments were conducted to determine an effect of creep temperature on creep behaviour of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373-573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). The microstructure analyses showed that microstructure of pure Cu processed by 8 ECAP passes and subsequent creep exposure contained large fraction of boundaries with coincidence sites lattice (CSL). The results showed that creep in UFG materials is influenced by additional creep mechanisms up to 0.5 Tm when the UFG microstructure in more or less stable.
Keywords: creep behaviour; EBSD; Ultrafine-grained microstructure
Project no.: CEZ:AV0Z20410507 (CEP), GPP108/10/P469 (CEP)
Funding provider: GA ČR
Host item entry: METAL 2012 Conference Proceedings, ISBN 978-80-87294-31-4
Institution: Institute of Physics of Materials AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0215262
Permalink: http://www.nusl.cz/ntk/nusl-135522
The record appears in these collections:
Research > Institutes ASCR > Institute of Physics of Materials
Conference materials > Papers
Record created 2013-01-04, last modified 2022-09-29