Original title: Vliv intenzity chlazení na růst intermetalických vrstev v bezolovnatém pájeném spoji
Translated title: Cooling effect on growth of intermetallic compounds in lead-free solder joints
Authors: Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Document type: Bachelor's theses
Year: 2008
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: cooling; IMC; intermetallic compounds; lead-free soldering; quality; reliability; bezolovnaté pájení; chlazení; intermetalické slitiny; jakost; spolehlivost

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/9293

Permalink: http://www.nusl.cz/ntk/nusl-220791


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2016-06-03, last modified 2017-06-28


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