Original title: Technological aspects of rework
Authors: Řihák, P.
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.
Host item entry: Proceedings of the 21st Conference STUDENT EEICT 2015, ISBN 978-80-214-5148-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/43031

Permalink: http://www.nusl.cz/ntk/nusl-207222


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers