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Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.
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Optimization of fabrication technology and defect detection for ceramics structures
Chyťa, Filip ; Otáhal, Alexandr (referee) ; Skácel, Josef (advisor)
This work deals with the problems of defects in ceramics structures and packages, their detection and subsequent optimization of the manufacturing process in order to eliminate these defects. The first chapter summarizes ceramic materials in elec-trical engineering and deals specifically with Al2O3 and material GRANNALOX 9620 F and optimization of its production profile. The second chapter deals with preparation of the ceramic powder and its subsequent processing. The third chap-ter deals with detection of defects in the thus formed ceramic packages, testing their electrical, thermal and mechanical makings. In the next chapter I deal with my workflow, which I used in the production of packages, the way of production and testing of packages, including comparison of their makings.
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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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Modern methods for Chip Attach
Nešpor, Dušan ; Novotný, Marek (referee) ; Szendiuch, Ivan (advisor)
The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different thermal and mechanical properties of used materials. Work contains modeling with program ANSYS and practical tests with testing packages. Determining a place in the solder with the maximal and the minimal stress values and determining of the stress distribution for all materials are the results of this research.
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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Advancing Packiging and 3D systems
Nicák, Michal ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.
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Analyze of Packaging Impact on Insulating properties
Pulec, Jiří ; Hejátková, Edita (referee) ; Szendiuch, Ivan (advisor)
Modern analog systems processing signals with very small amplitude are prone to distortion, which is caused by leakage between signal traces. Causation of this is contamination of insulating gap, which insulates these traces. Goal of this thesis is to design and manufacturing of test structure, which allows classification of influence of contamination on substrate on leakage, and another goal is classification of technologiacal processes in light of contamination of substrate with electroactive inpurities. Based on results of this experiments are defined rules leading to optimizing of properties of manufactured structures. Attention is applied to ceramic substrates with conductive traces which are created with thick film technology.
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