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Lead-free solder joint and environmental impacts
Kudláček, František ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to determine the effect of low-temperature lead-free solder during the aging process. The theoretical part deals with the types of lead-free solders and solder pastes used for the production of electrical circuits. In the practical part we deal with the design and measurement of the PCB. For our analysis, we pay more attention to the solder paste type Sn42Ag1Bi57 and its temperature profile. A four-point measurement method is used for evaluation, which shows us the difference between the measured values.
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Stencil Printing of Solder Paste and Process Optimization for Increasing Yield
Flos, Milan ; Sedlaříková, Marie (referee) ; Starý, Jiří (advisor)
This diploma thesis focuses on the comprehensive analysis and optimization of the solder paste stencil printing process, which is crucial for the production of high quality and reliable electronic devices. The work includes a review of the historical development of printing technologies, a comparison of different types of stencils and their surface treatment methods such as plasma-coating and electro-polishing. The practical part analyses data from automatic optical inspection (AOI) and solder paste inspection (SPI), with results showing that plasma-coated stencils achieve higher print quality. The investigation of surface hydrophobicity and microscopic analysis of the stencils provide important insights for improving manufacturing processes in the electronics industry.
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Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
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Analysis of Aplication Flux and Solder Paste on PCB for BGA components
Toufar, Michal ; Řihák, Pavel (referee) ; Vala, Radek (advisor)
This thesis deals with rework of BGA components. There are described defects and errors in a solder joints. The current trend is focused on thin packages with fine pitch. It is assembled with smaller and smaller solder balls. It is described effect of different application of flux and solders paste for rework. The main part is focused on dipping and dispensing. These methods are suitable for repair process.
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Defects caused of Solder Paste Application and Process Optimizing
Štichová, Zuzana ; Žilina, Michal Staník, EMTEST (referee) ; Starý, Jiří (advisor)
The aim of this work is documentation of cases, where the problems appear of solder paste reflow process, evaluation and recommendation for increasing quality of proposal PCB. This work contains also recommendation of process using adhesives for double-sided SMD assembly. At the cooperation with the firm Emtest, a.s. in Žilina, I mostly intent on optimalization of proposal footprints and realization of their changes as the one way of solving the problem. I made also statistics of solder paste reproducibility by JetPrinting technology.
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Flux Residues after Reflow Soldering
Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
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SnBi Solder Paste and Influence of Reactive Nanoparticles
Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.
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Inspection and optimization of soldering profiles of reflow furnaces
Flos, Milan ; Zatloukal, Miroslav (referee) ; Bača, Petr (advisor)
This thesis is focused on the implementation of solutions for the control of temperature profiles in an industrial environment. The theoretical part deals with the soldering process itself, individual types of soldering and their possible defects. Furthermore, the problem of temperature profiles, their division and the advantages and disadvantages of individual profiles were discussed. Subsequently, the measurement was performed on several remelting furnaces and its evaluation. Lastly, the design of the holder for the profilometer and the PCB itself was created.
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Semiautomatic Dispenser Application in Flexible Low Series PCB Assembly in SMT
Prikryl, Petr ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this thesis is solving the issue of introducing the Dotmaster semi-automatic dispenser into the flexible low series surface mount technology assembly of printed circuit boards. The first part of the thesis deals with the issue of introduction to the dispension of solderpastes, adhesives and packaging materials. The second part is focused on the description of the Dotmaster semi-autamatic. The last part is devoted to actual measuring and observation with the device using PD 860002 SA adhesive made by Heraeus company and SAC solder paste by Kester company. Showing the characteristics of dependecies of the shape of the dispensed adhesive and solder paste on several parameters of dispension follows.
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Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
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