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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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Optimalization of ultrasonic interconnection
Gregor, Pavel ; Hejátková, Edita (referee) ; Buršík, Martin (advisor)
The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.
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Hot-wire anemometer
Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The project deals with the effect of the airflow and temperature on the gold wirebond due to possible application in hot-wire anemometry. Theoretical fundamentals of wirebonding and hot-air anemometry are included in the text. From the area of anemometry, there is also a detailed description of measurement principles, areas of application and measuring instruments. The practical part of the text deals with design of the experimental sensor for hot-wire anemometry with use of the gold wirebond, including also the verification of the sensor's properties.
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Hot-wire anemometer
Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The project deals with the effect of the airflow and temperature on the gold wirebond due to possible application in hot-wire anemometry. Theoretical fundamentals of wirebonding and hot-air anemometry are included in the text. From the area of anemometry, there is also a detailed description of measurement principles, areas of application and measuring instruments. The practical part of the text deals with design of the experimental sensor for hot-wire anemometry with use of the gold wirebond, including also the verification of the sensor's properties.
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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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Optimalization of ultrasonic interconnection
Gregor, Pavel ; Hejátková, Edita (referee) ; Buršík, Martin (advisor)
The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.
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