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Assemblage and testing of the device for water ozonizing and its application for silicon wafer cleaning
Ředina, Dalibor ; Mikulík, Petr (referee) ; Voborný, Stanislav (advisor)
Deionised-ozonated water, so-called DIO3 appears to be an ideal alternative for usage in semiconductor industry. The utilisation of DIO3 for removal of photoresist from silicon wafers is faster, cheaper, and more environmental-friendly compared to classical technology based on mixture of sulphuric acid with hydrogen peroxide, so-called SPM. The diploma thesis deals firstly with research into ozone and ozonated water and their possible applications. Next sections describe two prototypes of generators for DIO3, that were assembled in CSVG a.s. Testing of parameters for generators on dissolved-ozone concentration is also a part of this thesis. Moreover, thesis involves tests, that were carrier out in ON Semiconductor in Rožnov pod Radhoštěm. These tests compare efficiency of cleaning by classical technology based on SPM and DIO3 approach.
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Contamination in semiconductor fabrication
Fojtášková, Helena ; Salyk, Ota (referee) ; Čech, Vladimír (advisor)
This bachelor thesis deals with contamination in the production of semiconductor substrates. It focuses on the efficiency and optimization of wet cleaning processes for monocrystalline silicon and silicon carbide semiconductor wafers. The thesis includes a literature research in the field of semiconductor manufacturing, wafer contamination and wafer cleaning processes. The most commonly studied metal contaminants include iron, copper and nickel, due to their high diffusivity, and therefore these elements were chosen for the experimental part. In the experimental part, wafers were prepared by targeted contamination to verify the effectiveness of the cleaning processes. Contamination analysis was performed using the vapour phase decomposition method combined with inductively coupled plasma mass spectrometry (VPD-ICP-MS) for silicon wafers and total reflection X-ray fluorescence (TXRF) for silicon carbide wafers. Based on the measurement results, the efficiency of the washing processes was evaluated and a procedure for process optimization was recommended.
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Contamination in semiconductor fabrication
Fojtášková, Helena ; Salyk, Ota (referee) ; Čech, Vladimír (advisor)
This bachelor thesis deals with contamination in the production of semiconductor substrates. It focuses on the efficiency and optimization of wet cleaning processes for monocrystalline silicon and silicon carbide semiconductor wafers. The thesis includes a literature research in the field of semiconductor manufacturing, wafer contamination and wafer cleaning processes. The most commonly studied metal contaminants include iron, copper and nickel, due to their high diffusivity, and therefore these elements were chosen for the experimental part. In the experimental part, wafers were prepared by targeted contamination to verify the effectiveness of the cleaning processes. Contamination analysis was performed using the vapour phase decomposition method combined with inductively coupled plasma mass spectrometry (VPD-ICP-MS) for silicon wafers and total reflection X-ray fluorescence (TXRF) for silicon carbide wafers. Based on the measurement results, the efficiency of the washing processes was evaluated and a procedure for process optimization was recommended.
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|
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Assemblage and testing of the device for water ozonizing and its application for silicon wafer cleaning
Ředina, Dalibor ; Mikulík, Petr (referee) ; Voborný, Stanislav (advisor)
Deionised-ozonated water, so-called DIO3 appears to be an ideal alternative for usage in semiconductor industry. The utilisation of DIO3 for removal of photoresist from silicon wafers is faster, cheaper, and more environmental-friendly compared to classical technology based on mixture of sulphuric acid with hydrogen peroxide, so-called SPM. The diploma thesis deals firstly with research into ozone and ozonated water and their possible applications. Next sections describe two prototypes of generators for DIO3, that were assembled in CSVG a.s. Testing of parameters for generators on dissolved-ozone concentration is also a part of this thesis. Moreover, thesis involves tests, that were carrier out in ON Semiconductor in Rožnov pod Radhoštěm. These tests compare efficiency of cleaning by classical technology based on SPM and DIO3 approach.
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