National Repository of Grey Literature 29 records found  previous11 - 20next  jump to record: Search took 0.01 seconds. 
Thermomechanical reliability of solder connection in electronic modules with LTCC
Krajíček, Michal ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.
The system for measurement of little flow
Karásek, Eduard ; Prášek, Jan (referee) ; Adámek, Martin (advisor)
Diploma thesis solves how to create system for measurement of little liquid flows. The basic types of liquid flowmeter, which are possible used for measurement of little liquid flows, are described in the introduction part of thesis. The limit for little flow is often determined as flow 100 mg.min-1 and low. Second part of this thesis describes the ways of capillary production and practical experiments with them. Thesis is focused to thick film technology and LTCC technology. Next part of this work is solution of simple measuring unit for measurement of little flows less than 100 mg.min 1, which is controlled by microprocessor ATmega16. The measuring unit can be worked separately or can be connected to PC. The next possibility of flowmeter optimisation is summarized in end of thesis.
The lamination of Low Temperature Co-fired Ceramic
Hudeček, Ondřej ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
Master’s thesis deals with the optimalization of low-temperature cofired ceramic lamination process that affects the final quality of 3D structures (eg., channels, cavities, membranes, etc.). The paper evaluates the influence of lamination parameters (pressure, temperature, time) on the formation of defects in the structure, which were detected by appropriate methods. The last parts describes designed and simulation cooling water system using LTCC technology.
Research and Development of 2D/3D Deformable Structures LTCC for Optoelectronic Applications
Somer, Jakub ; Pietriková,, Alena (referee) ; Husák, Miroslav (referee) ; Szendiuch, Ivan (advisor)
The doctoral thesis is focused on the research, development and production of deformation elements produced by LTCC technology for use in optoelectronic applications. A study of technological processes is carried out, with the emphasis on achieving accurate and reproducible mechanical component manufacturing so that these can be used on standard LTCC substrates in the commercial sphere. Therefore, available standard thick-film materials are used. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice. The dissertable core of the work is research and development of a technology using new principles and possibilities hidden in the mechanical parameters of LTCC structures, which are designed and used for the realization of deformation elements. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice.
Research and Development of 2D/3D Deformable Structures LTCC for Optoelectronic Applications
Somer, Jakub ; Pietriková,, Alena (referee) ; Husák, Miroslav (referee) ; Szendiuch, Ivan (advisor)
The doctoral thesis is focused on the research, development and production of deformation elements produced by LTCC technology for use in optoelectronic applications. A study of technological processes is carried out, with the emphasis on achieving accurate and reproducible mechanical component manufacturing so that these can be used on standard LTCC substrates in the commercial sphere. Therefore, available standard thick-film materials are used. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice. The dissertable core of the work is research and development of a technology using new principles and possibilities hidden in the mechanical parameters of LTCC structures, which are designed and used for the realization of deformation elements. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice.
Mutual interaction of multiple cracks growing in the particulate composite with brittle matrix under conditions of sub-critical crack growth
Slávik, Ondrej ; Ševeček, Oldřich (referee) ; Majer, Zdeněk (advisor)
In the first part of the submitted diploma thesis, the knowledge in the sphere of the fracture mechanics, related to the practice part of this thesis are summarized. In that the 2D parametrical numerical model of the particle composite with multiple cracks was created, using the finite elements method. Thanks to this model it is possible to find specific configurations which are showing the existance of multiple mutual interactions between these cracks, just by simple manipulation of the input data. In the calculations the influence of the residual stresses was considered which are formed during production of the material. The effect of the subcritical crack growth was taken into account as well in this thesis.
Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
The pressure measuring using LTCC technology
Straka, Michal ; Řezníček, Michal (referee) ; Kosina, Petr (advisor)
This thesis deals with the problems of the pressure sensor made on a low temperature co-fired ceramics. The pressure sensor converts the measured physical quantity to the electrical signal. The strain-gauge, capacitive and optical sensors are used for scanning of the pressure. It is possible to construct the multilayer sensors with holes and cutouts, through the use of the 3D structure on LTCC sensors. The passive parts can be applied on this layer through the thin-layer or thick-layer technology, which creates conductible paths and contacts for parts and outlets. In the practical part of the work, a few construction types of pressure sensors are designed, implemented and measured. Emphasis is given to strain-gauge strip sensor and possible problems during its manufacture, lamination and deformation of burn-out.

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