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Calculation of temperature field of the busbar bridge
Měrka, Ivan ; Maxa, Jiří (referee) ; Vyroubal, Petr (advisor)
This term project’s aim is to theoreticaly analyze thermal phenomena and losses in electrical power devices, describe the design and application of UniGear ZS1 type switchgear, put together a computer simulation model for thermal calculations of current and optimized solution and finally to discuss obtained results and compare them with experimentally acquired values. The main objective of this project is to determine, whether simulation is a viable and reliable enough method, that it could replace the costly real life physical testing. Modelling of the progress of thermal processes in different parts of the examined busbar will be done in computer aided design program Solidworks and its simulation plugin Flow Simulation.
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Applying SolidWorks Flow Simulation for cooling system of the power converter
Matoušek, Patrik ; Vetiška, Vojtěch (referee) ; Dostál, Lukáš (advisor)
Thesis deals with the issue of cooling power converters. It describes the disposition of power converter M50, produced by ELCOM, a.s., and the distribution and origin of heat losses in the converter. The thesis then describes the process of creating a 3D CAD model of the converter in Solidworks and the procedure for heat simulation of the converter in default state and with cooling fan failures using Solidworks Flow Simulation. The thesis then evaluates the results of these simulations, and on their basis it suggests possible improvements in the design of converter‘s cooling system. These improvements are then evaluated in further simulations. The thesis then describes the verification of performed simulations by comparison with a temperature-rise test.
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Usage of Busbar as a Source of Heat
Svoboda, Ondřej ; Macháček, Jan (referee) ; Radil, Lukáš (advisor)
This study is dedicated to the use of heat energy from the busbar and its cooling system. The study deals with thermal analysis of the busbar, both using numerical simulations in SolidWorks and practical examination – warming of the busbar. We can verify the correctness of the simulation from the measured values. To determine the temperature profile of the busbar, it is necessary to measure the temperature at various points of the busbar by contact method using thermocouple or contactless method using a thermal imager. Measurements are performed at the busbar LIA1600 made by Siemens Busbar Trunking System Mohelnice. The aim of the study is to analyze temperature busbar, to suggest the most efficient method of heat recovery, and to make economic calculation
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Simulation of temperature and airflow in a field distributor with frequency converter
Melechovský, Ondřej ; Maxa, Jiří (referee) ; Ondříček, Adam (advisor)
Presented work deals with heat transfer and its methods. At the beginning thesis describes the theory and the ways of heat transfer with connected quantities and equations. Then it explains the stack effect and impact of temperature on electro technical device. In work is also described ABB driver ACS line and calculation of heat transfer according to IEC 60890 standard. In the practical part there is the calculation of heat transfer in Flow Simulation simulating CFD program solved and finite element method is mentioned. Important part of work is devoted to setting and optimization of simulation. In conclusion are made some changes of construction of driver, dependence on heat transfer is inspected.
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Variable geometry of intake and exhaust ports of Wankel engine
Krejčí, Tomáš ; Beran, Martin (referee) ; Zháňal, Lubor (advisor)
The purpose of this thesis is to design the key parameters of the high-powered Walkel engine and to design a chamber side on the base of computed parameters so that it enables variable change of the intake and exhaust port geometry. Consequently, to carry out a flow simulation in both ports in designed chamber side in order to find out its flow character and geometry change reaction.
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Simulation of Heat Transfer in Low-Voltage Switchboard MNS - Optimization of Heat Transfer into The Switchboard
Czudek, Aleš ; Maxa, Jiří (referee) ; Vyroubal, Petr (advisor)
The thesis includes diagnostics temperature field of industrial low voltage. Place of origin, flow and heat transfer are important aspects in the design of the switchgear, especially in terms of proper equipment layout. The correctness of the design of the switchgear is verified by measuring the practical temperature field during testing or in work mode. To determine the temperature profile, it is necessary to measure the temperature at various points of the switchgear, either contact or contactless method. Measurements are performed on standardized low voltage switchboards, which are located power elements. The goal is to replace costly and time-consuming field testing switchgear efficient simulation of the temperature field mathematical model developed switchboards.
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Design of delta pi 3D printer with tempered bed using CAE systems
Koudela, Ondřej ; Maxa, Jiří (referee) ; Vyroubal, Petr (advisor)
This master's thesis deals with 3D printing using non-commercial 3D RepRap type printers. This work briefly describes development trends of non-commercial RepRap printers, theory of FDM print with analysis and comparison of materials, which are used in printing and the issue of the finite volume method and theory of heat diffusion. The practical part based on simulations from SolidWorks Flow Simulation discussed two basic methods of heating hot bed, then the temperature profile of hot end and the heat flow in full assembly of the printer. Outcome of this work is design an optimized model and the physical assembly of 3D printer delta pi type.
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Analysis of the distribution of the temperature profile in the furnace brazing using CAE systems
Stručovský, Aleš ; Vyroubal, Petr (referee) ; Maxa, Jiří (advisor)
The aim of this project is using the CAE system to analyze the distribution of the temperature profile brazing furnace DIMA 0180. To create the model is used SolidWorks Premium 2012. The simulation is performed using the Flow Simulation. This work builds on the knowledge diploma thesis by Martin Procházka titled The effect of different heat capacities and components on the longitudinal temperature profile for reflow soldering. We start from the knowledge of heat transfer, especially of heat conduction and radiation, which appear in the furnace.
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Simulation of Heat Transfer in Low-Voltage Switchboard MNS
Czudek, A.
The content of this work is the diagnosis of the temperature profile of industrial low voltage switchboards. Place of origin, flow and heat dissipation are important aspects in the design of the cabinet, particularly with regard to the layout of your devices. The correctness of the design cabinet can be verified by measuring the temperature field practical cabinet during testing or in work mode. Another option is to simulate the temperature profile of the low voltage. This can prevent waste of materials and saving money for the development
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