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Conducting connections of ceramic with FR4 in 3D structure
Pelc, Miroslav ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This work deals with conductive connections ceramic substrate with FR4 into three – dimensional structure. High frequency amplifier was created on ceramic substrate as a concrete application, for check quality substrate on resulting behavior circuit. The supply voltage for this amplifier is provided by the DC voltage source developed for FR4. Further the thesis deals with quality verification of substances conductive connection and individual aspects, with affect resulting reliability of connection.
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Temperature Profile in Reflow Soldering and Influence of Different PCBś and ComponentsThermal Capacities
Procházka, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.
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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
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Luminaires and Applications with Power LEDs
Vaňko, Adam ; Pavelka, Tomáš (referee) ; Baxant, Petr (advisor)
Progress in development of modern LEDs, their long lifetime and high luminous efficacy predetermine them for usage in lighting systems. This master's thesis examines possibilities of application of LEDs in luminaires, parameters of diodes and problems, which can appear in construction of luminaire with LED lighting source. In the practical part of this thesis a luminaire is designed, capable of illuminating traffic signs, vertical surfaces, billboards and fasades. By standards required parameters of a lighting system and adaptability of application must be considered in complex predesign. Simulations of lighting scene, created in special computer software, measurements of optical point’s parameters and construction of real luminaire model using high quality CREE LEDs, are included in analysis of the problem. Parameters of the luminaire were proved by measurements of product’s attributes at light laboratory. There are also some suggestions for improvement and further development of the product.
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Thermomechanical reliability of solder connection in electronic modules with LTCC
Krajíček, Michal ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.
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Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
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Conducting connections of ceramic with FR4 in 3D structure
Pelc, Miroslav ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This work deals with conductive connections ceramic substrate with FR4 into three – dimensional structure. High frequency amplifier was created on ceramic substrate as a concrete application, for check quality substrate on resulting behavior circuit. The supply voltage for this amplifier is provided by the DC voltage source developed for FR4. Further the thesis deals with quality verification of substances conductive connection and individual aspects, with affect resulting reliability of connection.
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