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Silver alloy wire-bonding
Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
This project deals with interconnection of semiconductor chips, especially interconnection using silver alloys. First part of this project contains interconnection methods and comparison of materials, which are used in wire bonding. Project include risk factors and the most frequent defects, which can appear during bonding. Next part contains testing proposals and testing of interconnected semiconductor chips.
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Resinate pastes
Tomašák, Lukáš ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The work is dedicated to the production of a thick film with resinate paste on a ceramic substrate based on a proposal test motive. It introduced the optimization of the workflow leading to the successful realization of the layer. Using an electron microscope, it is performed evaluation of the quality of resultant layer and analysis of the composition of the paste. In the last part of the work it is carried out measurements of temperature and electrical properties of resinate paste.
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Experimental Investigation of Integrated Thick Films
Čejka, Marek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor thesis deals with the theory of thick film technology. It describes implementation of thick layer integrated circuits, thick film technology, creen printing method. It includes basic electrical properties of thick layers. The aim of this work is the experimental work deals with the detection of current rating of conductors. The work includes the design of method of measuring and test structure.
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Electrical properties of thick film pastes measured in a wide temperature range
Gajdoš, Jiří ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The aim of this master’s thesis is to investigate the electrical properties of various thick-film resistor pastes in a wider temperature range. The thesis mainly focuses on a change in electrical resistance depending on temperatures, which extend to the cryogenic region. To achieve this, there is an overview of the thick-film technology properties, major technological procedures, principles of resistive pastes conductivity, methods of electrical resistance measuring, possible errors in measurement and methods of their minimization. The content of this work is also familiar with the characteristics of a cryogenic station, on this foundation was proposed the measurement procedure and created thick-film circuits for this station. After measurement in the interval 10 K to 350 K, there are subsequently evaluated the data and explains the principles of the conductivity of used pastes.
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Usage of Solders with Higher Melting Point for Hybrid Integrated Circuits
Janda, Ondřej ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
Bachelor thesis introduces the problematics of soldering, explains basic phenomena and principles affecting brazing and points out their positive and negative outcomes, as well as trying to suggest solutions to those negative symptoms accompanying the brazing. Practical part describes a design procedure of the test substrates, methodology of mechanical tests and optimalization of brazing process. As a part of the research, a design and construction of a various brazing tools with heat transfer through a conduit, is included.
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Definition of thermotension by lead and lead-free solders
Dvořák, Jaroslav ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
This research work is dealing with impact and size of the thermoelectric that may influence DC circuits. Main part of this thesis is to build experimental equipment for measurement of the thermoelectric and following usage this equipment for detection of the size the thermoelectric voltage for lead and lead-free solders. The theoretical part of this work deals with creation and usage of the thermoelectric in electrical engineering industry. In this particular part of this work is an example how the thermoelectric influence DC circuits. Then I describe thermoelectric generation from the motherboard to the die. The practical part of this thesis is focused on the development of the equipment for measuring of the thermoelectric of different types of materials. The Thermoelectric has been measured on two types of the lead, six types lead-free solders and on four types of the thermocouple wires. It has been measured within the range from 0°C to 80°C. In the end of this work is summary, where is reviewed witch of solders is the best for an applications affected by the thermoelectric.
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Non conventional applications of HIC´s
Klíma, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This thesis deals with non-conventional applications in the area of thick film technology, especially with indication of the temperature by thermodynamic sensors. The work summarizes thermodynamic sensors theory and also contains production data of the universal thermodynamic sensor realized on ceramic substrate, including measurement of its parameters and heat radiation.
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Switch stereo low frequency signals
Lukesle, Václav ; Jankovský, Jaroslav (referee) ; Hejátková, Edita (advisor)
The work proposes steps for fabricating low-frequency preamplifier including switchable inputs and the output equalizer. In the beginning of the thesis theoretical principles of amplifying the low-frequency signals are introduced. For setting the resonance frequency of equalizer the gyrator filter has been used. By setting the aforementioned frequency and tuning the potentiometer we are able to change the quality factor as well as the gain of the entire circuit. Benefit of this work is a large flexibility for tuning the output signal including a possibility of selection of four various inputs. Simulation and measurement results, PCB and a summary of discrete components are finally attached.
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Development of an electric shock welding method for a combination of thin-film and thick-film structures
Hruška, Andrej ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
At the start this bacherol thesis deals with connection methods of terminals on thick and thin-films. One of the methods, which this thesis is mostly orientated on, is a terminal connecting with the shock welding method. The point was to test, if this method of connecting terminals is suitable for a combination of the thick and thin-films applications. The experiment included making of template for vapour plating, vapour plating of thinfilm on substrate, its galvanic plating and testing. Mechanical tensile strength of created welds was tested and in the end there was done the optical inspection of internal interface of welds.
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