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Production process optimization
Habásko, Jakub ; Koška, Petr (referee) ; Fiala, Alois (advisor)
HABÁSKO Jakub: Production process optimization. The Master´s thesis of Master degree, second grade, school year 2008/2009, FME Brno University of Technology, Institute of Metrology and Quality Assurance Testing, October 2009, pages 68, pictures 40, tables 2, supplements 4. The project elaborated in frame of the Master degree, study branch Metrology and Quality Assurance Testing. This Master´s thesis deals with optimization of process plan. In virtue of submission was created an analysis present condition using of statistical methods and it was created suitable statistical methods applicable in production organization. Then is here described the problem of brazing bells, because in this place is originating the most of uptightness. Then the thesis brings recommendation and findings, which can help with optimization this process.
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Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
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QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
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Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
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Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
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Design of Soldering Gun
Běhal, Tomáš ; Křenek, Ladislav (referee) ; Ondra, Martin (advisor)
This bachelor thesis deals with the design of transformer soldering gun. The product is analyzed from the historical, technical and design ways at first. Subsequently, the new design of this product is proposed, with respect to ergonomic, technical, aesthetic and psychological aspects.
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Unconventional Metals Hardsurfacing Technologies
Krejčí, Vojtěch ; Šárka,, Šimůnková-Houdková (referee) ; Čelko, Ladislav (advisor)
The main objektive of the bachelor thesis is to evolve problems of metalic surface welding and to implement the basic partition of the most expanded used technologies of surface welding. Sometimes we can see the term deposition metalic surface welding too but in practice is used technical term metalic surface welding. The introdution includes the basic acquaintance with problems and the characterization of the proces of surface welding including the summary of its advantages and disadvantages. In other chapters we aim on individual technologies of surface welding, its principle and using in technical practice. Simultaneously is worked out the overview of already unused or minimally used technologies of surface welding. After the presentation of individual technologies follows the section dealing with partition of materials used for surface welding by the basic material as well as surface welding materials at the present technical practice. In the experimental section of thesis follows selected examples of using the presented technologies of surface welding in practice at present.
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