National Repository of Grey Literature 59 records found  beginprevious21 - 30nextend  jump to record: Search took 0.00 seconds. 
Design of Soldering Gun
Běhal, Tomáš ; Křenek, Ladislav (referee) ; Ondra, Martin (advisor)
This bachelor thesis deals with the design of transformer soldering gun. The product is analyzed from the historical, technical and design ways at first. Subsequently, the new design of this product is proposed, with respect to ergonomic, technical, aesthetic and psychological aspects.
The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
Increasing efficiency of MCA production lines with solder robots
Hajný, Pavel ; Pavlík, Jan (referee) ; Knoflíček, Radek (advisor)
This master thesis describes the design of increasing the efficiency of production lines with solder robots. In beginning of this work is a description of product and current process. There are also variants of design solutions for soldering palettes and the best on is chosen. The last part of this work includes design automation soldering process.
Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
FPGA based controller drive of BLDC motor
Makówka, David ; Kváš, Marek (referee) ; Valach, Soběslav (advisor)
This bachelor’s thesis concerns different control approaches for driving a BLDC motor using an FPGA chip. Also, a custom type of an inverter circuit was designed. A six-step commutation control scheme has been implemented, to ease the future integration of field-oriented control. The field-oriented control has been designed and simulated in a semestral thesis using a MATLAB Simulink tool. The targeted platform is the FPGA development board Basys 3. Hardware is rated to deliver up to 6 A of current. The handling of error conditions is mainly provided by a DRV8305 gate driver integrated circuit. Errors are also forwarded to the FPGA, for performing further actions. The structure of a controlling scheme is accustomed to the tuning of motor parameters rather than for end-users. Parameters can be set during motor operation and states of the control scheme are stepped separately. The sensing of voltages and currents is handled by an analog-digital converter.
Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
Service life increasing of spare part tools for ground cultivation
Černín, Jiří ; Mrňa, Libor (referee) ; Sigmund, Marian (advisor)
This diploma thesis deals with increasing the service life of parts intended for soil cultivation. The work evaluates the current possibilities of increasing the utility value of spare parts. Practical tests will provide recommendations for the most appropriate method to increase durability. The work examines uncharted methods of testing soldered joint. The results are evaluated in terms of quality and economic profitability. All results from this work are based on the basis of practical tests of plowing machine in rocky soil.
Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
Creation of workflows and soldering profiles on the HR600 station
Shakin, Pavel ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
This bachelor's thesis deals with the issues of mounting and reflow soldering of BGA integrated circuits. For the objectives of the bachelor's thesis, the ERSA HR600 repair soldering station was used and related to this, workflows were created and profiles were optimized for placement and reflow soldering of BGA integrated circuits, and the described processes were tested on 2 types of printed circuit boards that differed in size and component density including BGA package.
Stress-strain analysis of the brazed sidecar frame
Mrkva, Tomáš ; Řehák, Kamil (referee) ; Dlugoš, Jozef (advisor)
The thesis is about safety calculation of brazed sidecar frame using FEM simulations, more precisely stress-strain analysis. The first chapter is focused on the description of the brazing, the second chapter contains a brief description of the sidecar and its history. The third chapter of thesis is about the application of effective notch stress method to brazed joints and the creation of sidecar model for FEM analysis. The fourth chapter contains the procedure of creating model of geometry and FEM mesh of submodel. The last chapter of the thesis is a description and evaluation of the results of the different stress conditions, which are simulating real conditions that racing sidecar is being used in. These conditions are front wheel braking, side wheel braking, going through right turn, going through left turn and crossing unevenness.

National Repository of Grey Literature : 59 records found   beginprevious21 - 30nextend  jump to record:
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