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Thermal properties of automotive light sources - Halogen sources
Hlubinka, David ; Hájek, Vítězslav (referee) ; Janda, Marcel (advisor)
The aim of master´s thesis is to get acquainted with the design and materials used in selected automotive light source – tungsten halogen lamp. Further, the thesis focused on the theory and appropriate selection of the thermal measurement method on a real sample. Subsequently, a model of the light source and its simulation in the ANSYS – Maxwell 3D and Mechanical programs are created. Finally, the results of the thermal simulation and the non-contact measurement of the tungsten halogen lamp are evaluated
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Thermal Properties of Automotive Light Sources
Halbich, Adam ; Štěpánek, Jaroslav (referee) ; Baxant, Petr (advisor)
The goal of this thesis was to process theoretical basis required for better understanding the matters of thermal simulations, to perform particular simulation and its debugging according to the measurement on actual sample. Theoretical part focuses on the variety of the automotive light sources, then kinds of heat transfer, thermal simulations and possibilities of measurement and results verifying. Practical approach was consisted of reverse engineering of particular light source and building its 3D model. In consequence, the characterization of the material properties was made. At the end the thermal simulation of designed 3D model was performed and the optimalization according to realized measurement was implemented.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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The temperature profile of the power switching device of low voltage for different operating conditions
Mejzlík, Tomáš ; Valenta, Jiří (referee) ; Dostál, Lukáš (advisor)
The heat generated in a circuit breaker can be transmitted in two ways: Either through metal parts of current path to conductors outside of device or through plastic parts or air of chassis. The accuracy of the simulation depends on the accuracy of the 3D model and all his parts and it also depends on precise definition of materials with precise definition of electrical and thermal parameters. Electrical circuit breaker has various source of the heat which results in raising temperature of the device above the level of environment. Heat sources are: 1) Joule’s loss of the circuit breaker current path. 2) Heat loss in a bimetal, which is used for thermal release. 3) Resistivity of contacts. This thesis deals with static state of thermal analysis so the sources do not include transient heat source for switching OFF and switching ON. Electrical circuit breakers are made in smaller and smaller forms however their electrical parameters are not decreasing with size. There is logical conclusion that there is more heat on the same unit size which makes thermal analysis of circuit breaker one of the most important part of development.
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Study of BGA and QFN package properties
Skácel, Josef ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution. First part deals with analysis of the current status of packages. Next part is analyze the issue of heat transfer in electronic systems. The following section is an experimental dealing with simulation in ANSYS Workbench and validation of these simulations by designed test structures. At the end is evaluated properties and behavior of these packages.
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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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Structural analysis of part of electrical machine
Fodor, Viktor ; Hájek, Vítězslav (referee) ; Janda, Marcel (advisor)
This thesis discusses the optical diagnostics of electrical motor parts using a 3D scanner. It describes the construction of electrical induction motors, their heat losses, cooling and refrigeration systems that may be used by such motors. It approaches the possibilities of heat recording and briefly explains the 3D scanner’s principal. It also introduces the simulation program ANSYS which uses the finite element method. This thesis shows the post processing of the digitalized object and the simulations and compares the simulation and measurement results. The final part is devoted to the analysis of the obtained results.
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