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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Optimalization of power supply for LED light sources
Koždoň, Jakub ; Kosina, Petr (referee) ; Boušek, Jaroslav (advisor)
This work focuses on description of function, analysis of degradation process, measuring lifetime and design thermal and electrical driving circuit for LED. Lifetime power LED basically depends on their working temperature. So some methods for measuring and determine LED lifespan and impacts which affects their lifetime are going to be described. Driving circuits are one of keys of element lamps. Their characteristics can affect lifetime of all lamp. So some properties and impacts of circuits for driving LED's and their functions which are necessary need to know in design will be described . I'll also catalogue some circuits which are suitable for that and show particular design power supply for LEDs and it's realization.
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Application of graphite in thermal management of microelectronics
Havlíček, Václav ; Mačák, Martin (referee) ; Vyroubal, Petr (advisor)
Tato práce je zaměřena na zlepšení tepelného managementu mikroelektroniky implementací materiálů na bázi uhlíku, přesněji grafitových fólií, do tepelné architektury mikroelektroniky. Práce začíná vysvětlením současných metod chlazení a výzev v oblasti mikroelektroniky. Poté přechází k běžně používaným materiálům - hliníku a mědi a přidává do výběru i uhlíkové alotropie. Ve druhé části tato práce obsahuje několik příkladů použití pyrolytické grafitové fólie v tepelném managementu mikroelektroniky, prokazuje jeho použitelnost a analyzuje přínosy pro šíření tepla, tepelnou vodivost při dodržení elektrické izolace a možné využití ve flexibilní elektronice.
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REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
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Application Of Graphite In Thermal Management Of Microelectronics
Havlicek, Vaclav ; Vyroubal, Petr
This paper is shortly describing the possibility to improve the thermal management of microelectronics by implementing carbon-based materials, more exactly graphite foils. It explains current thermal challenges in the field of microelectronics and moves to commonly used materials, where it adds carbon allotropes into the scope, with a special focus on graphite foils. In the last part, this paper contains a use case of the pyrolytic graphite sheet in thermal management.
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Application of graphite in thermal management of microelectronics
Havlíček, Václav ; Mačák, Martin (referee) ; Vyroubal, Petr (advisor)
Tato práce je zaměřena na zlepšení tepelného managementu mikroelektroniky implementací materiálů na bázi uhlíku, přesněji grafitových fólií, do tepelné architektury mikroelektroniky. Práce začíná vysvětlením současných metod chlazení a výzev v oblasti mikroelektroniky. Poté přechází k běžně používaným materiálům - hliníku a mědi a přidává do výběru i uhlíkové alotropie. Ve druhé části tato práce obsahuje několik příkladů použití pyrolytické grafitové fólie v tepelném managementu mikroelektroniky, prokazuje jeho použitelnost a analyzuje přínosy pro šíření tepla, tepelnou vodivost při dodržení elektrické izolace a možné využití ve flexibilní elektronice.
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