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Trends in Solder Paste Area and Nanoparticles Influence
Dosedla, Milan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis deals with novel trends in solder paste technology. It focuses on nanoparticle applications used as a tool for improving a state of the art lead free solder alloys. The recently published results about the impact of different types of nanoparticles on properties of newly-emerged nanocomposite solders are discussed and summarized in the thesis. Preparation, practical application and testing of new solder paste based on low temperature SnBi alloy with an admixture of titanium dioxide are also discussed. Finally, properties of solder joints using these solder pastes are investigated and the results are evaluated.
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Solder Joint Electric Conductivity and Solder Joint Reliability
Lačný, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This work is considered about changes of electric conductivity in lead-free soldered joint's affected by current and thermal stress. The theoretical part describes factors influencing the solder joint electric conductivity and solder joint reliability. The basis of the practical part is the design of the testing method of the soldered joint's electric conductivity. The aim of this part is to measure and observe changes of solder joint electric conductivity after current and thermal stress in various material a procedural combinations.
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Solder Joint Reliability Prediction
Stejskal, Petr ; Skočil, Vlastimil (referee) ; Hovorka, Ladislav (referee) ; Kazelle, Jiří (advisor)
The thesis deals issue of the solder joint reliability and diagnostics. The manufacturing technology of electronics currently features a very high level of perfection. A large number of electrical devices ends its functional life due to solder joint failure. The objective of presented research consists studies of processes taking place in the solder joint due to soldering and after soldering. To this end, I will employ several methods of diagnostics. Noise based methods of solder joint measurement was evaluated. Based on a detailed study and understanding of processes it can be solder joint reliability predicted.
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Solder Joint Strength Measuring
Konečný, Aleš ; Chladil, Ladislav (referee) ; Starý, Jiří (advisor)
This thesis studies the definition of solder joint strength and its contributing factors. It also evaluates the options provided by using a MARK10 M5-100 digital force gauge with MESURgauge software for measuring solder joint strength and practically tests solder joint strength of SMD components sized 1206, 0805 and leads of THT components. Based on this, the thesis suggests further tests to be done in order to evaluates the degree to which each factor affects solder joint strength and suggests possible improvements of testing procedures used. These tests and improvements will be explored by a follow-up thesis, which will also be creating a part of a guide to a new laboratory exercise.
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Definition of thermotension by lead and lead-free solders
Dvořák, Jaroslav ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
This research work is dealing with impact and size of the thermoelectric that may influence DC circuits. Main part of this thesis is to build experimental equipment for measurement of the thermoelectric and following usage this equipment for detection of the size the thermoelectric voltage for lead and lead-free solders. The theoretical part of this work deals with creation and usage of the thermoelectric in electrical engineering industry. In this particular part of this work is an example how the thermoelectric influence DC circuits. Then I describe thermoelectric generation from the motherboard to the die. The practical part of this thesis is focused on the development of the equipment for measuring of the thermoelectric of different types of materials. The Thermoelectric has been measured on two types of the lead, six types lead-free solders and on four types of the thermocouple wires. It has been measured within the range from 0°C to 80°C. In the end of this work is summary, where is reviewed witch of solders is the best for an applications affected by the thermoelectric.
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The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
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Creep-fatigue models for solder joints reliability prediction
Novotný, Václav ; Šandera, Josef (referee) ; Švecová, Olga (advisor)
This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage for estimate of reliability solder joint, advantages and disadvantages. There are discusssed properties of single models, which are on different base. Purpose of this project is find optimal creep-fatigue model for lead-free solder and devise a test structure to which the model will be verified. Results are compared with theoretical calculations.
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Test Equipment for Solder Joint Strength Measuring
Čechák, Ondřej ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This master thesis introduces the problematics of the tensile strength of soldered joints and the correlative mathematical formulas and the use of mentioned problematics in the technology of die shear/pull machines designed for the solder joint tensile strength measurement. It explains the importance and reasons for the use of this technology. The emphasis is then laid on the design and construction innovations of the current laboratory manual shear/pull measuring machine, its semi-automation and the possibility of utilizing the innovated system in a laboratory class of a subject on FEEC BUT.
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