National Repository of Grey Literature 3 records found  Search took 0.02 seconds. 
Laserové zpracování z křemíku
Chmelíčková, Hana ; Lapšanská, Hana ; Hiklová, Helena ; Havelková, Martina ; Pavlíček, Pavel
Laser technologies in silicon treatment were introduced in article possibilities to break silicon wafers by means of Nd:YAG laser in university laboratory were examined.
Meření tvaru křemíkových desek pomocí interferometrie v bílém světle
Pavlíček, Pavel ; Chmelíčková, Hana
The form of silicon wafer is measured by white-light interferometry with measurement uncertainty about 1 μm. In this way waviness or deviations of the silicon wafers can be measured.
Hodnocení povrchu pomocí profilometru Form Talysurf series 2
Havelková, Martina ; Hiklová, Helena ; Chmelíčková, Hana
The performance of optical components, some biomedical materials or computer chips greatly depends on the shape and finish of the surface. Creating precise finishes on such objects requires precise ways of measuring the shape and structure of the surface.

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