|
|
New ways in Packaging
Hřešil, Tomáš ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This project deals with the creating a base of manual for modern electronic packages, which are more and more used in today's electronic circuits and devices. The modern packages are mentioned small outline DIL, QFP, BGA, PGA, CSP, Flip chip. The work is also including packages known SiP (System in Package) that are consisting or use the combinations of packages BGA, PGA, CSP and Flip Chip. At the end of the work are short described the most important design rules for assembly of mentioned packages on substrate (PCB).
|
|
|
Conductive net designing for thick film circuits
Strejček, Jindřich ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
Bachelor’s thesis was intent on determination the current rating thick film circuits. Describes an intelligent current source with voltage measurement function and its control. Contains a description of testing to test the test structure and processing of its results. From the evidence in trial testing was formed a new test structure, which was used for testing the current rating thic film conductors. Also copper conductors testing was performed. From measured values were drawed the graphs which represents current rating coductors in depend on width and temperature change of conductor.
|
|
|
Realization of hybrid integrated circuits leads for high-temperature applications
Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
|
|
| |
|
|
Conductive net designing for thick film circuits
Strejček, Jindřich ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
Bachelor’s thesis was intent on determination the current rating thick film circuits. Describes an intelligent current source with voltage measurement function and its control. Contains a description of testing to test the test structure and processing of its results. From the evidence in trial testing was formed a new test structure, which was used for testing the current rating thic film conductors. Also copper conductors testing was performed. From measured values were drawed the graphs which represents current rating coductors in depend on width and temperature change of conductor.
|
|
| |
|
|
Resinate pastes
Tomašák, Lukáš ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The work is dedicated to the production of a thick film with resinate paste on a ceramic substrate based on a proposal test motive. It introduced the optimization of the workflow leading to the successful realization of the layer. Using an electron microscope, it is performed evaluation of the quality of resultant layer and analysis of the composition of the paste. In the last part of the work it is carried out measurements of temperature and electrical properties of resinate paste.
|
|
|
Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
|
|
|
Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
|
|
|
Definition of thermotension by lead and lead-free solders
Dvořák, Jaroslav ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
This research work is dealing with impact and size of the thermoelectric that may influence DC circuits. Main part of this thesis is to build experimental equipment for measurement of the thermoelectric and following usage this equipment for detection of the size the thermoelectric voltage for lead and lead-free solders. The theoretical part of this work deals with creation and usage of the thermoelectric in electrical engineering industry. In this particular part of this work is an example how the thermoelectric influence DC circuits. Then I describe thermoelectric generation from the motherboard to the die. The practical part of this thesis is focused on the development of the equipment for measuring of the thermoelectric of different types of materials. The Thermoelectric has been measured on two types of the lead, six types lead-free solders and on four types of the thermocouple wires. It has been measured within the range from 0°C to 80°C. In the end of this work is summary, where is reviewed witch of solders is the best for an applications affected by the thermoelectric.
|
guest ::
RSS feed.